Datasheet TB67B000AHG (Toshiba) - 4

TB67B000AHG
Pin Description
Pin No. Symbol Description Function FGC = H: FG = output 1 ppr 1 FG FG signal output FGC = M: FG = output 2.4 ppr FGC = L: FG = output 3 ppr *ppr: one pulse per one electrical angle 2 VSP Voltage command input This pin has a pull-down resistor. (150 kΩ) This pin has a pull-down resistor. (200 kΩ) Input voltage range: 0 to 5 V (V 3 LA Lead angle control input refout) SS = H: 0 to 28° in 16 steps. SS = L: 0 to 58° in 32 steps. 5 OSCR Resistor for oscillation Connect a resistor for internal clock oscillation. 6 TR Motor lock detection Connect a capacitor for motor lock detection oscillation or connect to GND. 7 HUP U-phase hall input+ 8 HUM U-phase hall input- 9 HVP V-phase hall input+ When the hall signal inputs (UVW) are all Highs or all Lows, the gate block protection becomes active. Built-in digital filter (≈1.6 μs) 10 HVM V-phase hall input- 11 HWP W-phase hall input+ 12 HWM W-phase hall input- This pin has a pull-down resistor. (100 kΩ) H: FG = output 1 ppr. 13 FGC FG output signal switch M: FG = output 2.4 ppr. L: FG = output 3 ppr. *ppr: one pulse per one electrical angle 15 Vrefout Reference voltage output 5 V (typ.), 35 mA (max), Connecting a capacitor for voltage stability. This pin has a pull-down resistor. (100 kΩ) Switch for commutation 14 SS H: Wide-angle commutation (150° commutation) waveform L: Sine-wave PWM drive (180° commutation) This pin has a pull-down resistor. (100 kΩ) Forward/Reverse 17 CW/CCW H: Forward switching input L: Reverse This pin has a pull-up resistor. (200 kΩ) DC link input 16 Idc Current limit input Reference potential of 0.5 V. This pin has a RC filter (≈ 1 μs) and a digital filter (≈ 0.6 μs). Signal ground. 4 SGND Ground pin Connect with PGND. 19 VREG Reference voltage output 5 V (typ.), 30 mA (max). Connecting a capacitor for voltage stability. Power supply pin for the 18 VCC 15 V (typ.) power stage Power ground 20 PGND Ground pin Connect with SGND. 23 U U-phase output pin ― Bootstrap supply 24 BSU For connecting a bootstrap capacitor to the U-phase output. (phase U) 21 IS1 U-phase IGBT emitter For connecting a detecting resistor for motor coil current to the PGND pin. 22 IS2 V-phase IGBT emitter For connecting a detecting resistor for motor coil current to the PGND pin. Bootstrap supply 25 BSV For connecting a bootstrap capacitor to the V-phase output. (phase V) 26 V V-phase output pin ― High-voltage power 29 VBB Power supply pin for driving a motor. supply pin Bootstrap supply 27 BSW For connecting a bootstrap capacitor to the W-phase output. (phase W) 28 W W-phase output pin ― 30 IS3 W-phase IGBT emitter For connecting a detecting resistor for motor coil current to the PGND pin. 4 2019-05-30 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) High voltage 3-Phase Full-Wave PWM Brushless Motor Driver Features Block Diagram Pin Assignment Pin Description Input/Output Equivalent Circuits Absolute Maximum Ratings (Ta = 25 C) Operating conditions (Ta = 25 C) Power Dissipation Electrical Characteristics (Ta = 25 C) Functional Description 1. Basic Operation 2. Voltage Command (VSP) Signal and Bootstrap Voltage Regulation 3. Dead Time Insertion (cross conduction protection) 4. Lead Angle Control 5. PWM Carrier Frequency 6. Position Detecting Pin <Hall device input> <Hall IC input> 7. Rotating Pulse Output Timing Chart of FG Signal 8. Protection-related Functions 9. Motor-lock detection Timing Chart Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit Example External Parts Package Dimensions Notes on Contents IC Usage Considerations Notes on handling of ICs PD MAX – Ta 40 Power dissipation PD MAX (W) 30 20 10 0 0 25 50 75 100 125 150 Ambient temperature Ta ( C) ① INFINITE HEAT SINK : R(j-c = 1 C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : R(j-a = 17 C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : R(j-a = 35 C/W ④ IC only : R(j-a = 53 C/W PWM Duty (1) (2) (3) 92% 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V (1) (2) (3) 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V PWM Duty (Upper phase) *95% (typ.) *2.4% (typ.) RESTRICTIONS ON PRODUCT USE