Product Specification TSM250-130 (Littelfuse) - 2
| Fabricante | Littelfuse |
| Descripción | PolySwitch PTC Devices |
| Páginas / Página | 4 / 2 — PolySwitch®. PRODUCT: TSM250-130 Series. PTC Devices. Overcurrent … |
| Formato / tamaño de archivo | PDF / 498 Kb |
| Idioma del documento | Inglés |
PolySwitch®. PRODUCT: TSM250-130 Series. PTC Devices. Overcurrent Protection Device. Recommended Reflow Profile. Profile Feature
Línea de modelo para esta hoja de datos
Versión de texto del documento
PolySwitch® PRODUCT: TSM250-130 Series PTC Devices
DOCUMENT: SCD29377 REV L ETTER: C
Overcurrent Protection Device
REV DATE: June 10, 2019 PAGE NO.: 2 OF 4
Recommended Reflow Profile Profile Feature Pb-Free Assembly Average ramp up rate (TsMAX to Tp)
3℃/second max.
Preheat
* Temperature min. (TsMIN) 150℃ * Temperature max. (TsMA X) 200℃ * Time (tsMIN to tsMA X) 60-180 seconds
Time maintained above:
* Temperature (TL) 217 °C * Time (tL) 60-150 seconds
Peak/Classification Temperature (Tp)
260℃
Time within 5
℃
of actual peak temperature
* Time (tp) 20-40 seconds
Ramp down rate
6℃/second max.
Time 25
℃
to peak temperature
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface. Agency Recognitions:
UL (File #E74889)
Reference Documents:
PS300
Precedence:
This specification takes precedence over documents referenced herein
Effectivity:
Reference documents shall be the issue in effect on the date of invitation for bid.
Part Numbering System and Ordering Information
TSM 250 - 130 F - RA - 2 Packaging: 2 = Tape and Reel, (Blank)=Bulk Resistance Range F = RoHS Compliant, ELV Compliant Hold Current, mA Maximum Voltage Withstand, V Product Series: Dual Channels Surface Mount Device • Packaged with Tape and Reel only, Per EIA481-2 • Standard Package Quantity: 600pcs per reel • MPQ/MOQ: 3000pcs © 2018 Littelfuse,Inc Littelfuse.com Specifications are subject to change without notice. Revised Jun 10, 2019
DOCUMENT: SCD29377 REV L ETTER: C
Overcurrent Protection Device
REV DATE: June 10, 2019 PAGE NO.: 2 OF 4
Recommended Reflow Profile Profile Feature Pb-Free Assembly Average ramp up rate (TsMAX to Tp)
3℃/second max.
Preheat
* Temperature min. (TsMIN) 150℃ * Temperature max. (TsMA X) 200℃ * Time (tsMIN to tsMA X) 60-180 seconds
Time maintained above:
* Temperature (TL) 217 °C * Time (tL) 60-150 seconds
Peak/Classification Temperature (Tp)
260℃
Time within 5
℃
of actual peak temperature
* Time (tp) 20-40 seconds
Ramp down rate
6℃/second max.
Time 25
℃
to peak temperature
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface. Agency Recognitions:
UL (File #E74889)
Reference Documents:
PS300
Precedence:
This specification takes precedence over documents referenced herein
Effectivity:
Reference documents shall be the issue in effect on the date of invitation for bid.
Part Numbering System and Ordering Information
TSM 250 - 130 F - RA - 2 Packaging: 2 = Tape and Reel, (Blank)=Bulk Resistance Range F = RoHS Compliant, ELV Compliant Hold Current, mA Maximum Voltage Withstand, V Product Series: Dual Channels Surface Mount Device • Packaged with Tape and Reel only, Per EIA481-2 • Standard Package Quantity: 600pcs per reel • MPQ/MOQ: 3000pcs © 2018 Littelfuse,Inc Littelfuse.com Specifications are subject to change without notice. Revised Jun 10, 2019