Datasheet BM83 (Microchip) - 4

link to page 1 link to page 2 link to page 6 link to page 6 link to page 6 link to page 6 link to page 9 link to page 11 link to page 12 link to page 15 link to page 15 link to page 16 link to page 34 link to page 34 link to page 35 link to page 36 link to page 36 link to page 36 link to page 36 link to page 36 link to page 36 link to page 37 link to page 37 link to page 38 link to page 40 link to page 41 link to page 41 link to page 42 link to page 43 link to page 44 link to page 45 link to page 46 link to page 50 link to page 50 link to page 53 link to page 55 link to page 57 link to page 62
BM83 Table of Contents
Introduction...1 Features... 2 1. Quick References..6 1.1. Reference Documentation..6 1.2. Design Packages... 6 1.3. Acronyms/Abbreviations...6 2. Device Overview... 9 2.1. BM83 Module Pin Diagram...11 2.2. BM83 Module Pin Description.. 12 3. Audio Subsystem.. 15 3.1. Digital Signal Processor... 15 3.2. Codec... 16 3.3. Auxiliary Port.. 34 3.4. Analog Speaker Output.. 34 3.5. Microphone Inputs..35 4. Bluetooth Transceiver... 36 4.1. Transmitter... 36 4.2. Receiver... 36 4.3. Synthesizer...36 4.4.
Modulator-Demodulator
...36 4.5. Adaptive Frequency Hopping .. 36 5. Power Management Unit...37 5.1. Power Supply... 37 5.2. SAR ADC... 38 5.3. LED Drivers.. 40 6. Application Information..41 6.1. Power On/Off Sequence.. 41 6.2. Reset.. 42 6.3. Configuring and Programming .. 43 6.4. General Purpose I/O Pins.. 44 6.5. I2S Interface... 45 6.6. Host MCU Interface Over UART.. 46 7. PCB Antenna Information... 50 7.1. Antenna Radiation Pattern... 50 7.2. Module Placement Guidelines..53 8. Physical Dimensions... 55 9. Electrical Specifications.. 57 9.1. Timing Specifications..62 © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 4 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service