Datasheet TSSP930 (Vishay) - 5

FabricanteVishay
DescripciónIR Sensor Module for Reflective Sensor, Light Barrier, and Fast Proximity Applications
Páginas / Página7 / 5 — TSSP930.. PACKAGE DIMENSIONS
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Idioma del documentoInglés

TSSP930.. PACKAGE DIMENSIONS

TSSP930. PACKAGE DIMENSIONS

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TSSP930..
www.vishay.com Vishay Semiconductors
PACKAGE DIMENSIONS
in millimeters 5 Cavity number Marking area 5.4 2.25 R2.5 6.35 7.6 (5.05) (0.95) 15.2 ± 0.3 (3 x) 0.85 max. (1.1) 0.95 1 2 3 (3 x) 0.3 ± 0.1 (3 x) 0.6 ± 0.1 2.54 nom. 2.54 nom. Technical drawings according to DIN specifications R2.5 Not indicated tolerances ± 0.2 Drawing-No.: 6.550-5335.01-4 Issue: 2; 02.07.19 Rev. 1.2, 31-Jul-2019
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Document Number: 82866 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000