Datasheet AD7741 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | Single and Multichannel, Synchronous Voltage-to-Frequency Converters |
| Páginas / Página | 13 / 4 — AD7741 |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 238 Kb |
| Idioma del documento | Inglés |
AD7741
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AD7741 TIMING CHARACTERISTICS1, 2, 3 (VDD = +4.75 V to +5.25 V; VREF = +2.5 V. All specifications TMIN to TMAX unless otherwise noted.) Limit at TMIN, TMAX Parameter (B and Y Version) Units Conditions/Comments
fCLKIN 6.144 MHz max tHIGH/tLOW 55/45 max Input Clock Mark/Space Ratio 45/55 min t1 9 ns typ fCLOCK Rising Edge to fOUT Rising Edge t2 4 ns typ fOUT Rise Time t3 4 ns typ fOUT Fall Time t4 tHIGH ± 5 ns typ fOUT Pulsewidth NOTES 1Guaranteed by design and characterization, not production tested. 2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. 3See Figure 1. Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1, 2 tHIGH
(TA = +25°C unless otherwise noted) VDD to GND . –0.3 V to +7 V
CLKIN
Analog Input Voltage to GND . –5 V to VDD + 0.3 V
t4
Digital Input Voltage to GND . –0.3 V to VDD + 0.3 V
fOUT
Reference Input Voltage to GND . –0.3 V to VDD + 0.3 V
t t
f
2
OUT to GND . –0.3 V to VDD + 0.3 V
1 t3
Operating Temperature Range Automotive (Y Version) . –40°C to +105°C Figure 1. Timing Diagram Industrial (B Version) . –40°C to +85°C Storage Temperature Range . –65°C to +150°C Junction Temperature . +150°C Plastic DIP Package Power Dissipation . 450 mW θJA Thermal Impedance (8 Lead) . 125°C/W θJA Thermal Impedance (16 Lead) . 117°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . +215°C Infrared (15 sec) . +220°C SOIC Package Power Dissipation . 450 mW θJA Thermal Impedance (8 Lead) . 157°C/W θJA Thermal Impedance (16 Lead) . 125°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . +215°C Infrared (15 sec) . +220°C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD7741/AD7742 features proprietary ESD protection circuitry, permanent dam- age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD SENSITIVE DEVICE
ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. A
fCLKIN 6.144 MHz max tHIGH/tLOW 55/45 max Input Clock Mark/Space Ratio 45/55 min t1 9 ns typ fCLOCK Rising Edge to fOUT Rising Edge t2 4 ns typ fOUT Rise Time t3 4 ns typ fOUT Fall Time t4 tHIGH ± 5 ns typ fOUT Pulsewidth NOTES 1Guaranteed by design and characterization, not production tested. 2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. 3See Figure 1. Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1, 2 tHIGH
(TA = +25°C unless otherwise noted) VDD to GND . –0.3 V to +7 V
CLKIN
Analog Input Voltage to GND . –5 V to VDD + 0.3 V
t4
Digital Input Voltage to GND . –0.3 V to VDD + 0.3 V
fOUT
Reference Input Voltage to GND . –0.3 V to VDD + 0.3 V
t t
f
2
OUT to GND . –0.3 V to VDD + 0.3 V
1 t3
Operating Temperature Range Automotive (Y Version) . –40°C to +105°C Figure 1. Timing Diagram Industrial (B Version) . –40°C to +85°C Storage Temperature Range . –65°C to +150°C Junction Temperature . +150°C Plastic DIP Package Power Dissipation . 450 mW θJA Thermal Impedance (8 Lead) . 125°C/W θJA Thermal Impedance (16 Lead) . 117°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . +215°C Infrared (15 sec) . +220°C SOIC Package Power Dissipation . 450 mW θJA Thermal Impedance (8 Lead) . 157°C/W θJA Thermal Impedance (16 Lead) . 125°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . +215°C Infrared (15 sec) . +220°C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD7741/AD7742 features proprietary ESD protection circuitry, permanent dam- age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD SENSITIVE DEVICE
ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. A