Datasheet ADXL1003 (Analog Devices) - 4

link to page 4 link to page 4
ADXL1003 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Table 4. Recommended Soldering Profile Parameter Rating Condition
Acceleration
Profile Feature Sn63/Pb37 Pb-Free
Any Axis, Powered or Unpowered 10,000 g Average Ramp Rate (TL to TP) 3°C/sec 3°C/sec maximum maximum Drop Test (Concrete Surface) 1.2 m Preheat VDD −0.3 V to +5.5 V Minimum Temperature (TSMIN) 100°C 150°C Output Short-Circuit Duration Indefinite Maximum Temperature (T (Any Pin to Common Ground) SMAX) 150°C 200°C Time (TSMIN to TSMAX)(tS) 60 sec to 60 sec to Temperature Range (Storage) −55°C to +150°C 120 sec 180 sec Stresses at or above those listed under Absolute Maximum TSMAX to TL Ratings may cause permanent damage to the product. This is a Ramp-Up Rate 3°C/sec 3°C/sec stress rating only; functional operation of the product at these maximum maximum Time Maintained Above or any other conditions above those indicated in the operational Liquidous (TL) section of this specification is not implied. Operation beyond Liquidous Temperature (TL) 183°C 217°C the maximum operating conditions for extended periods may Time (tL) 60 sec to 60 sec to affect product reliability. 150 sec 150 sec
THERMAL RESISTANCE
Peak Temperature (TP) 240 + 0/−5°C 260 + 0/−5°C Time Within 5°C of Actual Peak 10 sec to 20 sec to Thermal performance is directly linked to printed circuit board Temperature (tP) 30 sec 40 sec (PCB) design and operating environment. Careful attention to Ramp-Down Rate 6°C/sec 6°C/sec PCB thermal design is required. maximum maximum Time 25°C to Peak Temperature 6 min 8 min θJA is the natural convection junction to ambient thermal (t25°C) maximum maximum resistance measured in a one cubic foot sealed enclosure. θ JC is the junction to case thermal resistance.
ESD CAUTION Table 3. Package Characteristics Package Type θJA θJC Device Weight
CP-32-261 48°C/W 14.1°C/W <0.2 g 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with nine thermal vias. See JEDEC JESD51.
RECOMMENDED SOLDERING PROFILE
Figure 2 and Table 4 provide details about the recommended soldering profile.
CRITICAL ZONE t P TL TO TP TP RAMP-UP TL T tL URE SMAX RAT E TSMIN P M E T tS PREHEAT RAMP-DOWN t25°C TO PEAK
002
TIME
6596- 1 Figure 2. Recommended Soldering Profile Rev. 0 | Page 4 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measure Mode Standby Mode BANDWIDTH APPLICATIONS INFORMATION APPLICATION CIRCUIT ON DEMAND SELF TEST RATIOMETRIC OUTPUT VOLTAGE INTERFACING ANALOG OUTPUT BELOW 10 kHz INTERFACING ANALOG OUTPUT BEYOND 10 kHz OVERRANGE MECHANICAL CONSIDERATIONS FOR MOUNTING LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE