Datasheet DA9220 (Dialog Semiconductor) - 7

FabricanteDialog Semiconductor
DescripciónHigh-Performance Dual-Channel DC-DC Converter
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DA9220. High-Performance Dual-Channel DC-DC Converter. Type. Drive. Reset. Pin No. Pin Name. Description. (Table 2). (mA). State

DA9220 High-Performance Dual-Channel DC-DC Converter Type Drive Reset Pin No Pin Name Description (Table 2) (mA) State

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DA9220 High-Performance Dual-Channel DC-DC Converter Type Drive Reset Pin No. Pin Name Description (Table 2) (mA) State
D4 AGND GND 10 Analog control and auxiliary circuitry VSS Buck2 positive node of differential voltage D5 FB2P AI 10 feedback, connect to VOUT2 at point of load Buck2 negative node of differential voltage D6 FB2N AI 10 feedback, connect to VSS at point of load
Table 2: Pin Type Definition Pin Type Description Pin Type Description
DI Digital input AI Analog input DO Digital output AO Analog output DIO Digital input/output AIO Analog input/output PWR Power GND Ground
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 7 of 61 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection