Datasheet TMD2635 (AustriaMicroSystems) - 6

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TMD2635 −
Electrical Characteristics
Symbol Parameter Conditions Min Typ Max Units
Time for device to wakeup from the sleep state and enter the active TWakeup 100 μs state if both PON and PEN are set to one at the same time. Time from power-on to ready to TActive 1.5 ms receive I²C commands
Note(s):
1. Values are shown at the VDD pin and do not include current through the IR VCSEL. 2. Active state occurs when PON = 1 and the device is actively integrating. This time is determined by the number of pulses (PPULSE) and the pulse length (PULSE_LEN) according to the formula: (7 x PULSE_LEN) + PPULSE x (2 x PULSE_LEN + 22μs) + 78.75μs. 3. Idle state occurs when PON = 1 and the device is not in the active state. 4. Sleep state occurs when PON = 0 and I²C bus is idle. If sleep state has been entered as the result of operational flow, SAI = 1, PON will remain high. 5. Digital pins: SDA, SCL, INT are tolerant to a communication voltage up to 3.4V.
Figure 8: Near Proximity Photodiode Optical Characteristics, VDD = 1.8V, VDD =3.0V, TA = 25ºC (unless otherwise noted) Parameter Conditions Min Typ Max Unit
PGAIN = 1x PLDRIVE = 7mA PPULSE = 5 pulses PPULSE_LEN = 12μs APC = disabled TEST9 = 0x0D Response: Absolute (1) BINSRCH_TARGET = 31 404 Counts Post Calibration Target material: 18% reflective surface No glass above module Target Size: 100mm x 100mm Target Distance: 10mm Part to Part Variation (1)(2) Same as Response: absolute ±25 % Noise (1)(2) Same as Response: absolute ±2 % Same as Response: absolute Response: No target (1)(3) except no target above the 19 30 41 Counts module
Note(s):
1. Representative result by characterization. 2. 3 sigma (σ) variation. 3. Response with no target varies with power supply characteristics and system noise.
Page 6 ams Datasheet
Document Feedback [v1-00] 2019-Jul-17 Document Outline General Description Key Benefits & Features Applications Block Diagram Pin Assignment Absolute Maximum Ratings Electrical Characteristics Timing Characteristics Detailed Description Proximity Operation Proximity I²C Characteristics Alternate I²C Address Option I²C Write Transaction I²C Read Transaction Simplified State Diagram Register Description ENABLE Register (0x80) PRATE Register (0x82) PILTL Register (0x88) PILTH Register (0x89) PIHTL Register (0x8A) PIHTH Register (0x8B) PERS Register (0x8C) CFG0 Register (0x8D) PCFG0 Register (0x8E) PCFG1 Register (0x8F) REVID Register (0x91) ID Register (0x92) STATUS Register (0x9B) PDATAL Register (0x9C) PDATAH Register (0x9D) REVID2 Register (0xA6) SOFTRST Register (0xA8) PWTIME Register (0xA9) CFG8 Register (0xAA) CFG3 Register (0xAB) CFG6 Register (0xAE) PFILTER Register (0xB3) POFFSETL Register (0xC0) POFFSETH Register (0xC1) CALIB Register (0xD7) CALIBCFG Register (0xD9) CALIBSTAT Register (0xDC) INTENAB Register (0xDD) FAC_L Register (0xE5) FAC_H Register (0xE6) TEST9 Register (0xF9) Application Information PCB Pad Layout Packaging Drawings Tape & Reel Information Soldering & Storage Information Storage Information Moisture Sensitivity Shelf Life Floor Life Rebaking Instructions Laser Eye Safety Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information Content Guide