Preliminary Datasheet P9415 (IDT) - 5
| Fabricante | IDT |
| Descripción | Medium Power Wireless Transmitter/Receiver (TRx) |
| Páginas / Página | 26 / 5 — Absolute Maximum Ratings. Table 2. Absolute Maximum Ratings. Conditions. … |
| Revisión | 20190829 |
| Formato / tamaño de archivo | PDF / 1.3 Mb |
| Idioma del documento | Inglés |
Absolute Maximum Ratings. Table 2. Absolute Maximum Ratings. Conditions. Minimum. Maximum. Units
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P9415 Preliminary Datasheet
Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Functional operation of the P9415 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol/Pins Parameter
Conditions Minimum Maximum Units
TJ Junction temperature - - 150 °C TS Storage temperature - -55 150 °C HBM ESD – Human Body Model - - 2000 V CDM ESD – Charged Device - - 500 V Model CMA, CMB, COM1, COM2, PCLAMP, VRECT, AC1, AC2 Maximum Voltage -0.3 23.5 V BST1, BST2 Maximum Voltage -0.3 AC1+5, AC2+5 V LDO1P8, GP0-GP6 Maximum Voltage -0.3 2 V LDO5P0, DEMOD, nEN, ECLAMP_DRV, OD0-OD4 Maximum Voltage -0.3 6 V PGND Maximum Voltage -0.3 0.3 V VOUT Maximum Voltage -0.3 21 V CMA, CMB, COM1, COM2 Maximum RMS Current 500 mA AC1, AC2 Maximum RMS Current1 2 A VOUT Output Current Maximum RMS Current 1.65 A
Thermal Characteristics1,2,3,4 Table 3. Thermal Characteristics
Symbol Parameter
Value Units
θJA Theta JA. Junction to ambient. 45 °C/W θJB Theta JB. Junction to board. 4.36 °C/W θJC Theta JC. Junction to case. 0.2 °C/W - Moisture Sensitivity Rating (Per J-STD-020) MSL 1 -
Notes:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum al owable power dissipation wil result in excessive die temperature, and the device wil enter thermal shutdown. 2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in stil air conditions. 3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. 4. For the WLCSP (AWQ53) package, connecting 8 PGND balls and at least 2 other CSP balls (10 thermal Balls total) to internal/external ground planes from top to bottom sides of the PCB is recommended for improving the overall thermal performance. © 2019 IDT A Renesas Company. 5 Revision 0.8 August 29, 2019
Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Functional operation of the P9415 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol/Pins Parameter
Conditions Minimum Maximum Units
TJ Junction temperature - - 150 °C TS Storage temperature - -55 150 °C HBM ESD – Human Body Model - - 2000 V CDM ESD – Charged Device - - 500 V Model CMA, CMB, COM1, COM2, PCLAMP, VRECT, AC1, AC2 Maximum Voltage -0.3 23.5 V BST1, BST2 Maximum Voltage -0.3 AC1+5, AC2+5 V LDO1P8, GP0-GP6 Maximum Voltage -0.3 2 V LDO5P0, DEMOD, nEN, ECLAMP_DRV, OD0-OD4 Maximum Voltage -0.3 6 V PGND Maximum Voltage -0.3 0.3 V VOUT Maximum Voltage -0.3 21 V CMA, CMB, COM1, COM2 Maximum RMS Current 500 mA AC1, AC2 Maximum RMS Current1 2 A VOUT Output Current Maximum RMS Current 1.65 A
Thermal Characteristics1,2,3,4 Table 3. Thermal Characteristics
Symbol Parameter
Value Units
θJA Theta JA. Junction to ambient. 45 °C/W θJB Theta JB. Junction to board. 4.36 °C/W θJC Theta JC. Junction to case. 0.2 °C/W - Moisture Sensitivity Rating (Per J-STD-020) MSL 1 -
Notes:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum al owable power dissipation wil result in excessive die temperature, and the device wil enter thermal shutdown. 2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in stil air conditions. 3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. 4. For the WLCSP (AWQ53) package, connecting 8 PGND balls and at least 2 other CSP balls (10 thermal Balls total) to internal/external ground planes from top to bottom sides of the PCB is recommended for improving the overall thermal performance. © 2019 IDT A Renesas Company. 5 Revision 0.8 August 29, 2019