BSC034N06NSMaximum ratings, at T j=25 °C, unless otherwise specified ParameterSymbol ConditionsValueUnit Power dissipation P tot T C=25 °C 74 W T A=25 °C, 2.5 R thJA=50 K/W2) Operating and storage temperature T j, T stg -55 ... 150 °C IEC climatic category; DIN IEC 68-1 55/150/56 ParameterSymbol ConditionsValuesUnitmin.typ.max.Thermal characteristics Thermal resistance, junction - case R thJC bottom - - 1.7 K/W top - - 20 Device on PCB R thJA 6 cm2 cooling area2) - - 50 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 60 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=41 µA 2.1 2.8 3.3 V DS=60 V, V GS=0 V, Zero gate voltage drain current I DSS - 0.1 1 µA T j=25 °C V DS=60 V, V GS=0 V, - 10 100 T j=125 °C Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=10 V, I D=50 A - 2.8 3.4 mW V GS=6 V, I D=12.5 A - 4.0 5.1 Gate resistance R G - 1.3 2.0 W |V DS|>2|I D|R DS(on)max, Transconductance g fs 46 93 - S I D=50 A Rev.2.0 page 2 2013-10-17