Datasheet ICM7555 (NXP) - 5

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NXP Semiconductors ICM7555 General purpose CMOS timer Table 5. Characteristics
…continued Tamb = 25 °C unless otherwise specified.
Sym Parameter Conditions Min Typ Max Unit bol
II input current TRIGGER VDD = Vtrig = Vmax - 50 - pA VDD = Vtrig = 5 V - 10 - pA VDD = Vtrig = Vmin - 1 - pA THRESHOLD VDD = Vth = Vmax - 50 - pA VDD = Vth = 5 V - 10 - pA VDD = Vth = Vmin - 1 - pA RESET VDD = Vrst = Vmax - 100 - pA VDD = Vrst = 5 V - 20 - pA VDD = Vrst = Vmin - 2 - pA VOL LOW-level output voltage VDD = Vmax; Isink = 3.2 mA - 0.1 0.4 V VDD = 5 V; Isink = 3.2 mA - 0.2 0.4 V VOH HIGH-level output voltage Isource = −1.0 mA VDD = Vmax 15.25 15.7 - V VDD = 5 Vmax 4.0 4.5 - V Vo output voltage DISCHARGE: - 0.2 0.4 V VDD = 5 V; IDIS = 10 mA tr(o) output rise time[4] RL = 10 MΩ; CL = 10 pF; - 45 75 ns VDD = 5 V tf(o) output fall time[4] - 20 75 ns fosc oscillator frequency astable mode - - 500 kHz [1] The supply current value is essentially independent of the TRIGGER, THRESHOLD and RESET voltages. [2] Astable timing is calculated using the following equation: 1.38 f = (---------------- R + 2R )C A B The components are defined in Figure 15. [3] RA, RB = 1 kΩ to 100 kΩ; C = 0.1 µF; 5 V < VDD < 15 V [4] Parameter is not 100 % tested. ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 5 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents