Datasheet VM3000 (Vesper) - 9

VM3000
Low Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
PRELIMINARY DATASHEET HANDLING INSTRUCTIONS
The Piezo MEMS microphone is very robust to harsh environments such as dust and moisture. However, to avoid mechanical damage to the mic we recommend using appropriate handling procedures when manual y handling the parts or when using pick and place equipment. The following guidelines will avoid damage: • Do not apply a vacuum to the bottom side of the microphone. A vacuum pen may be used with care on the top side only. • Do not apply very high air pressure over the port hole. • Do not insert any large particles or objects in the port hole. The microphone is robust to small particles per IP5x specification. • Do not board wash or clean after the reflow process or expose the acoustic port to harsh chemicals.
DIMENSIONS AND PIN LAYOUT Pin Number Pin Name Description
1 DATA PDM Digital Output 2 L/R SELECT Left/Right Channel Select 3 NC No Connect 4 NC No Connect 5 CLK Clock 6 VDD Power Supply 7 GND Ground Document Name: VM3000_Datasheet Page 9 of 12 Vesper reserves the right to alter the datasheet specifications Revision: U0.0.0 without notification. Vesper assumes no liability for the use of engineering samples and offers no warranty for this product. info@vespermems.com Document Outline GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION BLOCK DIAGRAM TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS PDM DIGITAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ENVIRONMENTAL ROBUSTNESS RELIABILITY SPECIFCATIONS MICROPHONE OPERATION MICROPHONE MODES TIMING SPECIFICATIONS TYPICAL PERFORMANCE CHARACTERISTICS SOLDER REFLOW PROFILE HANDLING INSTRUCTIONS DIMENSIONS AND PIN LAYOUT PCB DESIGN AND LAND PATTERN LAYOUT TAPE AND REEL SPECIFICATIONS LID MARKING SUPPORTING DOCUMENTS COMPLIANCE INFORMATION CONTACT DETAILS LEGAL INFORMATION REVISION HISTORY