Datasheet BC846BPN (NXP) - 4
| Fabricante | NXP |
| Descripción | 65 V, 100 mA NPN/PNP general-purpose transistor |
| Páginas / Página | 15 / 4 — NXP Semiconductors. BC846BPN. 65 V, 100 mA NPN/PNP general-purpose … |
| Formato / tamaño de archivo | PDF / 133 Kb |
| Idioma del documento | Inglés |
NXP Semiconductors. BC846BPN. 65 V, 100 mA NPN/PNP general-purpose transistor. Thermal characteristics. Table 7. Symbol. Parameter
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NXP Semiconductors BC846BPN 65 V, 100 mA NPN/PNP general-purpose transistor 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor
Rth(j-a) thermal resistance from in free air [1] - - 625 K/W junction to ambient Rth(j-sp) thermal resistance from - - 230 K/W junction to solder point
Per device
Rth(j-a) thermal resistance from in free air [1] - - 416 K/W junction to ambient [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 006aab619 103 δ = 1 Zth(j-a) 0.75 (K/W) 0.50 0.33 102 0.20 0.10 0.05 0.02 10 0.01 0 1 10−5 10−3 10−2 10−4 10 102 10−1 103 1 tp (s) FR4 PCB, standard footprint
Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC846BPN_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 4 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
NXP Semiconductors BC846BPN 65 V, 100 mA NPN/PNP general-purpose transistor 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor
Rth(j-a) thermal resistance from in free air [1] - - 625 K/W junction to ambient Rth(j-sp) thermal resistance from - - 230 K/W junction to solder point
Per device
Rth(j-a) thermal resistance from in free air [1] - - 416 K/W junction to ambient [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 006aab619 103 δ = 1 Zth(j-a) 0.75 (K/W) 0.50 0.33 102 0.20 0.10 0.05 0.02 10 0.01 0 1 10−5 10−3 10−2 10−4 10 102 10−1 103 1 tp (s) FR4 PCB, standard footprint
Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC846BPN_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 4 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents