Datasheet HMC960LP4E (Analog Devices) - 8

HMC960LP4E
v01.1212
DC - 100 MHz DUAL DigitAL VAriAbLe gAin AMpLifier with DriVer table 3. Absolute Maximum ratings
Nominal 5 V Supply to GND Reflow Soldering -0.3 to 5.5 V VDDI, VDDQ, DVDD Peak Temperature 260 °C Time at Peak Temperature 40 µs Common Mode Inputs Pins -0.3 to 5.5 V (CMI, CMQ) ESD Sensitivity (HBM) 1 kV Class 1 C Input and Output Pins IIP, IIN, IQP, IQN, OIP, OIN, OQP, -0.3 to 5.5 V Stresses above those listed under Absolute Maximum Ratings may OQN cause permanent damage to the device. This is a stress rating only; Digital Pins functional operation of the device at these or any other conditions SEN, SDI, SCK, SDO, GC[6:0] -0.3 to 5.5 V above those indicated in the operational section of this specification SDO min load impedance 1 kΩ is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Operating Temperature Range -40 to +85 °C Storage Temperature -65 to +125 °C Maximum Junction Temperature 125 °C ELECTROSTATIC SENSITIVE DEVICE Thermal Resistance (Rth) OBSERVE HANDLING PRECAUTIONS (junction to ground paddle) 10 °C/W
Outline Drawing
T M S - G IN S S E C RO P D N NOTES: [1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC A SILICA AND SILICON IMPREGNATED. B [2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. [3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. E [4] DIMENSIONS ARE IN INCHES [MILLIMETERS]. [5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE. S [6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL A BE 0.25m MAX. [7] PACKAGE WARP SHALL NOT EXCEED 0.05mm [8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. [9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND IF/B PATTERN.
package information
Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1] H960 HMC960LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C Inf F or o m r p atio r n fic ur e n , d ishe e d lbiv y e An ry a alog n Ded t viceo p s is la belciee o ved rd to e b r e sa: H ccur iattte itae M nd rel iic a r bl o e. w H a o v we e C ver, noo For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rporation, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 978-250-3343 tel • 978-250-3373 fax • O rights of third parties that may result from its use. Specifications subject to change without notice. No rd P e hor O ne n : 7 -li 81 n -3e a 29- t w 470 ww. 0 • O h rdit e tit r oe n .lic n om license is granted by implication or otherwise under any patent or patent rights of Analog Devices. e at www.analog.com
8
Application S Trademarks and registered trademarks are the property of their respective owners. upport: apps@ Aphpilittciatteio.co n S m upport: Phone: 1-800-ANALOG-D