ADL5330Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSIN GAENBLVPS2VPS2VPS2VPS2242322212019VPS1 118 VPS2COM1 217 COM2INHI 3ADL533016 OPHIINLO 4TOP VIEW15 OPLO(Not to Scale)COM1 514 COM2VPS1 613 VPS278910111212EFMLOMPBSIPBSVROCOGNCONOTES1. EXPOSED PAD. THE EXPOSED PAD UNDERTHE DEVICE MUST BE CONNECTED TO 002 GROUND VIA A LOW IMPEDANCE PATH,THERMALLY AND ELECTRICALLY. 05134- Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No.MnemonicDescriptions 1, 6, 13, 18 to 22 VPS1, VPS2 Positive Supply. Nominally equal to 5 V. 2, 5, 10 COM1 Common for Input Stage. 3, 4 INHI, INLO Differential Inputs, AC-Coupled. 7 VREF Voltage Reference. Output at 1.5 V; normally ac-coupled to ground. 8 IPBS Input Bias. Normally ac-coupled to ground. 9 OPBS Output Bias. AC-Coupled to ground. 11 GNLO Gain Control Common. Connect to ground. 12, 14, 17 COM2 Common for Output Stage. 15 OPLO Low Side of Differential Output. Bias to VP with RF chokes. 16 OPHI High Side of Differential Output. Bias to VP with RF chokes. 23 ENBL Device Enable. Apply logic high for normal operation. 24 GAIN Gain Control Voltage Input. Nominal range 0 V to 1.4 V. EPAD Exposed Pad. The exposed pad under the device must be connected to ground via a low impedance path, thermally and electrically. Rev. B | Page 6 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BASIC CONNECTIONS RF INPUT/OUTPUT INTERFACE GAIN CONTROL INPUT AUTOMATIC GAIN CONTROL INTERFACING TO AN IQ MODULATOR WCDMA TRANSMIT APPLICATION CDMA2000 TRANSMIT APPLICATION SOLDERING INFORMATION EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE