Datasheet AD8264 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | Quad, 235 MHz, DC-Coupled VGA and Differential Output Amplifier |
| Páginas / Página | 37 / 6 — AD8264. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| Revisión | C |
| Formato / tamaño de archivo | PDF / 1.3 Mb |
| Idioma del documento | Inglés |
AD8264. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter. Rating. Table 3. Thermal Resistance
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AD8264 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Voltage soldered in a circuit board for surface-mount packages. The θJA Supply Voltage (VPOS, VNEG) ±6 V values in Table 3 assume a 4-layer JEDEC standard board with Input Voltage (INPx) VPOS, VNEG zero airflow. Gain Voltage (GNHx, GNLO) VPOS, VNEG
Table 3. Thermal Resistance
Power Dissipation 2.5 W
Package Type θJA θJC Unit
Temperature CP-40-91 31.0 2.3 °C/W Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C 1 4-Layer JEDEC board (2S2P). Lead Temperature (Soldering, 60 sec) 300°C Package Glass Transition Temperature (T
MAXIMUM POWER DISSIPATION
G) 150°C The maximum safe power dissipation for the AD8264 is limited Stresses at or above those listed under Absolute Maximum by the associated rise in junction temperature (TJ) on the die. At Ratings may cause permanent damage to the product. This is a approximately 150°C, which is the glass transition temperature, stress rating only; functional operation of the product at these the properties of the plastic change. Even temporarily exceeding or any other conditions above those indicated in the operational this temperature limit may change the stresses that the package section of this specification is not implied. Operation beyond exerts on the die, permanently shifting the parametric performance the maximum operating conditions for extended periods may of the amplifiers. Exceeding a temperature of 150°C for an affect product reliability. extended period can cause changes in silicon devices, potential y resulting in a loss of functionality.
ESD CAUTION
Rev. C | Page 6 of 37 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION OVERVIEW PREAMP VGA POST AMPLIFIER VOCM Pin OFSx Pins NOISE APPLICATIONS INFORMATION A LOW CHANNEL COUNT APPLICATION CONCEPT USING A DISCRETE REFERENCE A DC CONNECTED CONCEPT EXAMPLE EVALUATION BOARD CONNECTING AND USING THE AD8264-EVALZ OUTLINE DIMENSIONS ORDERING GUIDE
AD8264 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Voltage soldered in a circuit board for surface-mount packages. The θJA Supply Voltage (VPOS, VNEG) ±6 V values in Table 3 assume a 4-layer JEDEC standard board with Input Voltage (INPx) VPOS, VNEG zero airflow. Gain Voltage (GNHx, GNLO) VPOS, VNEG
Table 3. Thermal Resistance
Power Dissipation 2.5 W
Package Type θJA θJC Unit
Temperature CP-40-91 31.0 2.3 °C/W Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C 1 4-Layer JEDEC board (2S2P). Lead Temperature (Soldering, 60 sec) 300°C Package Glass Transition Temperature (T
MAXIMUM POWER DISSIPATION
G) 150°C The maximum safe power dissipation for the AD8264 is limited Stresses at or above those listed under Absolute Maximum by the associated rise in junction temperature (TJ) on the die. At Ratings may cause permanent damage to the product. This is a approximately 150°C, which is the glass transition temperature, stress rating only; functional operation of the product at these the properties of the plastic change. Even temporarily exceeding or any other conditions above those indicated in the operational this temperature limit may change the stresses that the package section of this specification is not implied. Operation beyond exerts on the die, permanently shifting the parametric performance the maximum operating conditions for extended periods may of the amplifiers. Exceeding a temperature of 150°C for an affect product reliability. extended period can cause changes in silicon devices, potential y resulting in a loss of functionality.
ESD CAUTION
Rev. C | Page 6 of 37 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION OVERVIEW PREAMP VGA POST AMPLIFIER VOCM Pin OFSx Pins NOISE APPLICATIONS INFORMATION A LOW CHANNEL COUNT APPLICATION CONCEPT USING A DISCRETE REFERENCE A DC CONNECTED CONCEPT EXAMPLE EVALUATION BOARD CONNECTING AND USING THE AD8264-EVALZ OUTLINE DIMENSIONS ORDERING GUIDE