Datasheet AD7466-KGD (Analog Devices) - 9
| Fabricante | Analog Devices |
| Descripción | 1.6 V Micro-Power 12-Bit ADC |
| Páginas / Página | 9 / 9 — Known Good Die. AD7466-KGD. OUTLINE DIMENSIONS. 0.500. 0.880. 2.185. A … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 177 Kb |
| Idioma del documento | Inglés |
Known Good Die. AD7466-KGD. OUTLINE DIMENSIONS. 0.500. 0.880. 2.185. A 1-. TOP VIEW. SIDE VIEW. 0.076 × 0.076. (CIRCUIT SIDE). 03- 1- 1
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Known Good Die AD7466-KGD OUTLINE DIMENSIONS 0.500 0.880 1 6 2 5 2.185 3 4 A 1- TOP VIEW SIDE VIEW 1 0.076 × 0.076 (CIRCUIT SIDE) 20 03- 1- 1
Figure 5. 6-Pad Bare Die [CHIP] (C-6-4) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 660 (x) × 2015 (y) µm Scribe Line Width 120 (x) × 170 (y) µm Die Size 880 (x) × 2185 (y) µm Thickness 500 µm Backside Silicon Not applicable Passivation Nitride Not applicable Bond Pads (Minimum Size) 76 × 76 µm Bond Pad Composition 99.5% Al, 0.5% Cu % ESD 3.5 kV
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Five First
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7466-KGD-DF −40°C to +85°C 6-Pad Bare Die [CHIP] C-6-4
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10315-0-10/14(A)
Rev. A | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS TIMING EXAMPLES Timing Example 1 Timing Example 2 ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 5. 6-Pad Bare Die [CHIP] (C-6-4) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 660 (x) × 2015 (y) µm Scribe Line Width 120 (x) × 170 (y) µm Die Size 880 (x) × 2185 (y) µm Thickness 500 µm Backside Silicon Not applicable Passivation Nitride Not applicable Bond Pads (Minimum Size) 76 × 76 µm Bond Pad Composition 99.5% Al, 0.5% Cu % ESD 3.5 kV
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Five First
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7466-KGD-DF −40°C to +85°C 6-Pad Bare Die [CHIP] C-6-4
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10315-0-10/14(A)
Rev. A | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS TIMING EXAMPLES Timing Example 1 Timing Example 2 ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE