Datasheet MMBT2222A, PZT2222A (ON Semiconductor) - 7
| Fabricante | ON Semiconductor |
| Descripción | (Legacy Fairchild) NPN General Purpose Amplifier |
| Páginas / Página | 10 / 7 — MMBT2222A / PZT2222A — NPN General-Purpose Amplifier Physical Dimensions … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 388 Kb |
| Idioma del documento | Inglés |
MMBT2222A / PZT2222A — NPN General-Purpose Amplifier Physical Dimensions 0.95 2.92±0.20. 1.40 1.30+0.20. -0.15 1 2.20 2. 0.60
Línea de modelo para esta hoja de datos
Versión de texto del documento
MMBT2222A / PZT2222A — NPN General-Purpose Amplifier Physical Dimensions 0.95 2.92±0.20
3
1.40 1.30+0.20
-0.15 1 2.20 2
0.60
0.37 (0.29)
0.95 0.20 1.00 A B 1.90 1.90
LAND PATTERN
RECOMMENDATION
SEE DETAIL A 1.20 MAX 0.10
0.00 (0.93) 0.10 C C
2.40±0.30 NOTES: UNLESS OTHERWISE SPECIFIED GAGE PLANE 0.23
0.08 A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M -1994.
E) DRAWING FILE NAME: MA03DREV10 0.25 0.20 MIN
(0.55) SEATING
PLANE SCALE: 2X Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MA/MA03D.pdf.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-MA03D.pdf. © 2004 Fairchild Semiconductor Corporation
MMBT2222A / PZT2222A Rev. 1.1.0 www.fairchildsemi.com
6
3
1.40 1.30+0.20
-0.15 1 2.20 2
0.60
0.37 (0.29)
0.95 0.20 1.00 A B 1.90 1.90
LAND PATTERN
RECOMMENDATION
SEE DETAIL A 1.20 MAX 0.10
0.00 (0.93) 0.10 C C
2.40±0.30 NOTES: UNLESS OTHERWISE SPECIFIED GAGE PLANE 0.23
0.08 A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M -1994.
E) DRAWING FILE NAME: MA03DREV10 0.25 0.20 MIN
(0.55) SEATING
PLANE SCALE: 2X Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MA/MA03D.pdf.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-MA03D.pdf. © 2004 Fairchild Semiconductor Corporation
MMBT2222A / PZT2222A Rev. 1.1.0 www.fairchildsemi.com
6