Datasheet ADL5335 (Analog Devices) - 7

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Data Sheet ADL5335 ABSOLUTE MAXIMUM RATINGS THREMAL RESISTANCE Table 3. Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage, V (PCB) design and operating environment. Careful attention to POS 5.5 V SCLK, SDIO, CS, FA 3.9 V PCB thermal design is required. Enable Voltage, ENBL 2.2 V Table 4 shows the thermal resistance from the die to ambient Input Average RF Power 12 dBm (θJA) and die to lead (θJC), respectively. Equivalent Voltage, Sine Wave Input1 2.5 V p-p
Table 4. Thermal Resistance
Internal Power Dissipation 725 mW
Package Type θ
Maximum Junction Temperature 150°C
JA θJC Unit
Operating Temperature Range −40°C to +85°C CP-16-39 58.7 2.2 °C/W Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C
ESD CAUTION
1 If the common-mode voltage at the inputs (VCOM) is closer than 0.625 V from either rail voltage (VRAIL), the equivalent voltage reduces to (|VRAIL − VCOM|) × 4, where VRAIL is the rail closest to VCOM. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 7 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DIGITAL LOGIC TIMING SPI Timing Diagram ABSOLUTE MAXIMUM RATINGS THREMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BASIC STRUCTURE DIGITAL INTERFACE OVERVIEW Serial Peripheral Interface (SPI) Fast Attack (FA) APPLICATIONS INFORMATION BASIC CONNECTIONS OUTLINE DIMENSIONS ORDERING GUIDE