Datasheet AD7606-EP (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 8-Channel DAS with 16-Bit, Bipolar, Simultaneous Sampling ADC |
| Páginas / Página | 15 / 8 — AD7606-EP. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. … |
| Formato / tamaño de archivo | PDF / 279 Kb |
| Idioma del documento | Inglés |
AD7606-EP. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance
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AD7606-EP Data Sheet ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to PCB design and
Parameter Rating
operating environment. Careful attention to PCB thermal AV design is required. CC to AGND −0.3 V to +7 V VDRIVE to AGND −0.3 V to AVCC + 0.3 V θJA is the natural convection, junction to ambient thermal Analog Input Voltage to AGND1 ±16.5 V resistance measured in a one cubic foot sealed enclosure. Digital Input Voltage to AGND −0.3 V to VDRIVE + 0.3 V θJC is the junction to case thermal resistance. Digital Output Voltage to AGND −0.3 V to VDRIVE + 0.3 V REFIN to AGND −0.3 V to AVCC + 0.3 V
Table 4. Thermal Resistance
Input Current to Any Pin Except Supplies1 ±10 mA
Package Type θJA θJC Unit
Operating Temperature Range −55°C to +125°C ST-64-21 45 11 °C/W Storage Temperature Range −65°C to +150°C 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test Junction Temperature 150°C board. See JEDEC JESD-51. Soldering Reflow Temperature 260 (0)°C Electrostatic Discharge (ESD) All Pins Except Analog Inputs 2 kV
ESD CAUTION
Analog Input Pins Only 7 kV 1 Transient currents of up to 100 mA do not cause silicon controlled rectifier (SCR) latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 8 of 15 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY GENERAL DESCRIPTION SPECIFICATIONS TIMING SPECIFICATIONS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to PCB design and
Parameter Rating
operating environment. Careful attention to PCB thermal AV design is required. CC to AGND −0.3 V to +7 V VDRIVE to AGND −0.3 V to AVCC + 0.3 V θJA is the natural convection, junction to ambient thermal Analog Input Voltage to AGND1 ±16.5 V resistance measured in a one cubic foot sealed enclosure. Digital Input Voltage to AGND −0.3 V to VDRIVE + 0.3 V θJC is the junction to case thermal resistance. Digital Output Voltage to AGND −0.3 V to VDRIVE + 0.3 V REFIN to AGND −0.3 V to AVCC + 0.3 V
Table 4. Thermal Resistance
Input Current to Any Pin Except Supplies1 ±10 mA
Package Type θJA θJC Unit
Operating Temperature Range −55°C to +125°C ST-64-21 45 11 °C/W Storage Temperature Range −65°C to +150°C 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test Junction Temperature 150°C board. See JEDEC JESD-51. Soldering Reflow Temperature 260 (0)°C Electrostatic Discharge (ESD) All Pins Except Analog Inputs 2 kV
ESD CAUTION
Analog Input Pins Only 7 kV 1 Transient currents of up to 100 mA do not cause silicon controlled rectifier (SCR) latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 8 of 15 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY GENERAL DESCRIPTION SPECIFICATIONS TIMING SPECIFICATIONS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE