Datasheet ADN2805 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 1.25 Gbps Clock and Data Recovery IC |
| Páginas / Página | 16 / 6 — ADN2805. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL CHARACTERISTICS. … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 293 Kb |
| Idioma del documento | Inglés |
ADN2805. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL CHARACTERISTICS. Thermal Resistance. Table 4. Parameter Rating
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ADN2805 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS
TA = TMIN to TMAX, VCC = VMIN to VMAX, VEE = 0 V, CF = 0.47 μF, SLICEP = SLICEN = VEE, unless otherwise noted.
Thermal Resistance
4-layer board with exposed paddle soldered to VEE.
Table 4. Parameter Rating Table 5. Thermal Resistance
Supply Voltage (VCC) 4.2 V
Package Type θJA Unit
Minimum Input Voltage (All Inputs) VEE − 0.4 V 32-Lead LFCSP 28 °C/W Maximum Input Voltage (All Inputs) VCC + 0.4 V Maximum Junction Temperature 125°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS JITTER SPECIFICATIONS OUTPUT AND TIMING SPECIFICATIONS Timing Characteristics ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Thermal Resistance ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS I2C INTERFACE TIMING AND INTERNAL REGISTER DESCRIPTION THEORY OF OPERATION FUNCTIONAL DESCRIPTION FREQUENCY ACQUISITION INPUT BUFFER LOCK DETECTOR OPERATION Normal Mode LOL Detector Operation Using a Reference Clock Static LOL Mode SQUELCH MODE SYSTEM RESET I2C INTERFACE APPLICATIONS INFORMATION PCB DESIGN GUIDELINES Power Supply Connections and Ground Planes Transmission Lines Soldering Guidelines for Lead Frame Chip Scale Package OUTLINE DIMENSIONS ORDERING GUIDE
TA = TMIN to TMAX, VCC = VMIN to VMAX, VEE = 0 V, CF = 0.47 μF, SLICEP = SLICEN = VEE, unless otherwise noted.
Thermal Resistance
4-layer board with exposed paddle soldered to VEE.
Table 4. Parameter Rating Table 5. Thermal Resistance
Supply Voltage (VCC) 4.2 V
Package Type θJA Unit
Minimum Input Voltage (All Inputs) VEE − 0.4 V 32-Lead LFCSP 28 °C/W Maximum Input Voltage (All Inputs) VCC + 0.4 V Maximum Junction Temperature 125°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS JITTER SPECIFICATIONS OUTPUT AND TIMING SPECIFICATIONS Timing Characteristics ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Thermal Resistance ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS I2C INTERFACE TIMING AND INTERNAL REGISTER DESCRIPTION THEORY OF OPERATION FUNCTIONAL DESCRIPTION FREQUENCY ACQUISITION INPUT BUFFER LOCK DETECTOR OPERATION Normal Mode LOL Detector Operation Using a Reference Clock Static LOL Mode SQUELCH MODE SYSTEM RESET I2C INTERFACE APPLICATIONS INFORMATION PCB DESIGN GUIDELINES Power Supply Connections and Ground Planes Transmission Lines Soldering Guidelines for Lead Frame Chip Scale Package OUTLINE DIMENSIONS ORDERING GUIDE