Preliminary Datasheet SETP0805-100-CC (Littelfuse) - 2

PolySwitch® PRODUCT: SETP0805-100-CC setP™ Devices
DOCUMENT: SCD29367 REV LETTER: C
Temperature Indicator
REV DATE: MARCH 8, 2019 PAGE NO.: 2 OF 4 Agency Recognition: UL, TUV Reference Document: PS300 Precedence: This specification takes precedence over documents referenced herein. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid.
MATERIALS INFORMATION ROHS Compliant ELV Compliant Pb-Free Halogen Free* HF
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
SOLDER REFLOW RECOMMENDATIONS:
Recommended pad layout (mm.)
1.20 1.50 1.00 1.00
Recommended reflow profile
Pb-Free Profile Feature Assembly Average ramp up rate (Tsmax to
3°C/s max.
Tp) Preheat
• Temperature min. (Tsmin) 150°C • Temperature max. (Tsmax) 200°C • Time (tsmin to tsmax) 60-120s
Time maintained above:
• Temperature (TL) 217°C • Time (tL) 60-150s
Peak/Classification
260°C
temperature (Tp) Time within 5°C of actual peak
30s max.
temperature
(tp)
Ramp down rate
2°C/s max.
Time 25°C to peak temperature
8 mins max. Notes:  All temperature refers to topside of the package, measured on the package body surface. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. littelfuse.com Revised March 8, 2019