Datasheet XP (IDT) - 3

XP Datasheet
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the device. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Thermal characteristics, in actual applications, should be assessed case by case to guarantee junction temperature does not exceed 125°C.
Table 2. Absolute Maximum Ratings Item Rating
VDD -0.5V to +3.8V OE -0.5V to +3.8V Storage Temperature -55°C to 125°C Maximum Junction Temperature 125°C Theta J 1 A 75.9 °C/W 89.6 °C/W 97.4 °C/W JD8 JX8 JSW8 Theta J 1 B 48.6 °C/W 54.3 °C/W 66.8 °C/W 1 Thermal characteristics are based on simulation in standard condition.
ESD Compliance Table 3. ESD Compliance
Human Body Model (HBM) 2000V
Mechanical Testing Table 4. Mechanical Testing * Parameter Test Method
Mechanical Shock Half-sine wave with 0.3ms 3000G. X, Y, Z each direction 1 time. Frequency: 10 to 55MHz amplitude: 1.5mm. Mechanical Vibration Frequency: 55–2000Hz peak value: 20G. Duration time: 4H for each X,Y,Z axis; total 12hours. High Temp Operating Life (HTOL) 1000 hours at 125°C (under power). Hermetic Seal Gross leak (air leak test). Fine leak (Helium leak test) He-pressure: 6kgf/cm² 2 hours. * MSL level does not apply.
Solder Reflow Profile
tP 10 seconds Max within 5°C of 260°C peak 260°C Ramp up 3°C/s Max 225°C Ramp down not to 50 ±10 seconds exceed 6°C/s 180°C above 225°C reflow area 160°C 120 ±20 seconds in pre-heating area 25°C 400 seconds Max from +25°C to 260°C peak ©2019 Integrated Device Technology, Inc. 3 April 1, 2019 Document Outline Description Features Pin Assignments Figure 1. 7.0 × 5.0 mm, 5.0 × 3.2 mm, and 3.2 × 2.5 mm Packages Table 1. Pin Descriptions Absolute Maximum Ratings Table 2. Absolute Maximum Ratings ESD Compliance Table 3. ESD Compliance Mechanical Testing Table 4. Mechanical Testing * Solder Reflow Profile DC Electrical Characteristics Table 5. 3.3V IDD DC Electrical Characteristics Table 6. 2.5V IDD DC Electrical Characteristics Table 7. 1.8V IDD DC Electrical Characteristics Table 8. LVCMOS DC Electrical Characteristics Table 9. LVDS DC Electrical Characteristics Table 10. LVPECL DC Electrical Characteristics Table 11. HCSL DC Electrical Characteristics Table 12. CML DC Electrical Characteristics Table 13. DC Electrical Characteristics – Leakage Current AC Electrical Characteristics Table 14. 3.3V AC Electrical Characteristics Table 15. 2.5V AC Electrical Characteristics Table 16. 1.8V AC Electrical Characteristics Table 17. Phase Jitter Characteristics Output Waveforms Figure 2. LVDS Output Waveforms Figure 3. LVPECL Output Waveforms Figure 4. HCSL Output Waveforms Figure 5. CML Output Waveforms Termination for 3.3V LVPECL Outputs Figure 6. 3.3V LVPECL Output Termination Figure 7. 3.3V LVPECL Output Termination Termination for 2.5V LVPECL Outputs Figure 8. 2.5V LVPECL Driver Termination Example Figure 9. 2.5V LVPECL Driver Termination Example Figure 10. 2.5V LVPECL Driver Termination Example LVDS Driver Termination Figure 11. Standard LVDS Termination Figure 12. Optional LVDS Termination Recommended Termination for HCSL Outputs Figure 13. Recommended Source Termination (where the driver and receiver will be on separate PCBs) Figure 14. Recommended Termination (where a point-to-point connection can be used) CML Termination Figure 15. CML Termination Example Package Outline Drawings Marking Diagrams Figure 16. Marking Configuration for the 7.0 × 5.0 mm and 5.0 × 3.2 mm Packages Figure 17. Marking Configuration for the 3.2 × 2.5 mm Package Ordering Information Revision History