Datasheet BC556B, BC557A, BC557B, BC557C, BC558B (ON Semiconductor)

link to page 6 BC556B, BC557A, B, C, BC558B Amplifier Transistors
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• Pb−Free Packages are Available* COLLECTOR 1
MAXIMUM RATINGS
2 BASE
Rating Symbol Value Unit
Collector - Emitter Voltage VCEO Vdc BC556 −65 3 BC557 −45 EMITTER BC558 −30 Collector - Base Voltage VCBO Vdc BC556 −80 BC557 −50 BC558 −30
TO−92
Emitter - Base Voltage VEBO −5.0 Vdc
CASE 29 STYLE 17
Collector Current − Continuous IC −100 mAdc Collector Current − Peak ICM −200 1 1 Base Current − Peak I 2 2 BM −200 mAdc 3 3 Total Device Dissipation @ TA = 25°C PD 625 mW STRAIGHT LEAD BENT LEAD Derate above 25°C 5.0 mW/°C BULK PACK TAPE & REEL AMMO PACK Total Device Dissipation @ TC = 25°C PD 1.5 W Derate above 25°C 12 mW/°C
MARKING DIAGRAM
Operating and Storage Junction TJ, Tstg −55 to +150 °C Temperature Range
THERMAL CHARACTERISTICS Characteristic Symbol Max Unit
BC 55xx Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W AYWW G Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W G Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. xx = 6B, 7A, 7B, 7C, or 8B A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
March, 2007 − Rev. 3 BC556B/D