Datasheet IRLL110, SiHLL110 (Vishay) - 2

FabricanteVishay
DescripciónPower MOSFET
Páginas / Página9 / 2 — IRLL110, SiHLL110. THERMAL RESISTANCE RATINGS. PARAMETER SYMBOL. TYP. …
Formato / tamaño de archivoPDF / 364 Kb
Idioma del documentoInglés

IRLL110, SiHLL110. THERMAL RESISTANCE RATINGS. PARAMETER SYMBOL. TYP. MAX. UNIT. Note. SPECIFICATIONS. TEST. CONDITIONS. MIN. Static. Dynamic

IRLL110, SiHLL110 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP MAX UNIT Note SPECIFICATIONS TEST CONDITIONS MIN Static Dynamic

Línea de modelo para esta hoja de datos

Versión de texto del documento

IRLL110, SiHLL110
www.vishay.com Vishay Siliconix
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient  (PCB Mount) a RthJA - 60 °C/W Maximum Junction-to-Case (Drain) RthJC - 40
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
SPECIFICATIONS
(TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static
Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 μA 100 - - V VDS Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.12 - V/°C Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 μA 1.0 - 2.0 V Gate-Source Leakage IGSS VGS = ± 10 V - - ± 100 nA VDS = 100 V, VGS = 0 V - - 25 Zero Gate Voltage Drain Current IDSS μA VDS = 80 V, VGS = 0 V, TJ = 125 °C - - 250 VGS = 5.0 V ID = 0.90 Ab - - 0.54 Drain-Source On-State Resistance R DS(on) VGS = 4.0 V ID = 0.75 A - - 0.76 Forward Transconductance gfs VDS = 25 V, ID = 0.90 A 0.57 - - S
Dynamic
Input Capacitance Ciss V - 250 - GS = 0 V, Output Capacitance Coss VDS = 25 V, - 80 - pF f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance Crss - 15 - Total Gate Charge Qg - - 6.1 I Gate-Source Charge Qgs V D = 5.6 A, VDS = 80 V, GS = 5.0 V - - 2.6 nC see fig. 6 and 13b Gate-Drain Charge Qgd - - 3.3 Turn-On Delay Time td(on) - 9.3 - Rise Time tr V - 47 - DD = 50 V, ID = 5.6 A, ns R Turn-Off Delay Time t g = 12 , RD = 8.4 d(off) - 16 - Fall Time tf - 18 - Between lead, D Internal Drain Inductance LD - 4.0 - 6 mm (0.25") from package and center of nH G Internal Source Inductance L die contact S - 6.0 - S
Drain-Source Body Diode Characteristics
MOSFET symbol Continuous Source-Drain Diode Current I D S - - 1.5 showing the  integral reverse A G Pulsed Diode Forward Current a ISM p - n junction diode - - 12 S Body Diode Voltage VSD TJ = 25 °C, IS = 1.5 A, VGS = 0 Vb - - 2.5 V Body Diode Reverse Recovery Time trr - 110 130 ns TJ = 25 °C, IF = 5.6 A, dI/dt = 100 A/μsb Body Diode Reverse Recovery Charge Qrr - 0.50 0.65 μC Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width  300 μs; duty cycle  2 %. S15-1195-Rev. F, 25-May-15
2
Document Number: 91320 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000