Datasheet HMC480ST89, 480ST89E (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 5 GHz |
| Páginas / Página | 6 / 4 — HMC480ST89 / 480ST89E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 5 GHz. … |
| Formato / tamaño de archivo | PDF / 337 Kb |
| Idioma del documento | Inglés |
HMC480ST89 / 480ST89E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 5 GHz. Absolute Maximum Ratings. Outline Drawing
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HMC480ST89 / 480ST89E
v02.0710
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 5 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +6.0 Vdc RF Input Power (RFIN)(Vcc = +5 Vdc) +11 dBm ELECTROSTATIC SENSITIVE DEVICE 8 OBSERVE HANDLING PRECAUTIONS Junction Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.536 W (derate 8.25 mW/°C above 85 °C) T Thermal Resistance 122 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C K - SM OC BL IN
Outline Drawing
A & G R E IV R - D S R IE NOTES: 1. PACKAGE BODY MATERIAL: IF MOLDING COMPOUND MP-180S OR EQUIVALENT. L 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. P 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] M 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. A 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H480 HMC480ST89 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H480 HMC480ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Info F rmoatr pr ion f iurcne, de ished b ly iv A e n r al y o a g D n evd to p ices is bla eli c eve o ed t rde o be ras: H ccuratite tiatne M d reli iacr ble ow . Ho av wev e C er, n o o rpo Fora r t p iro ic n e ,, 2 d 0 eli A ve lrpha R y, and toad, C o place hoel rd m er s s fo : Ard, MA 01 nalog Devic 8 e 2 s 4 , Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rde hone r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .ehit r o t nilte in .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
8 - 125
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r app tion Su s p @ po h rt itt : P ite ho .c ne o : 1m -800-ANALOG-D
v02.0710
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 5 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +6.0 Vdc RF Input Power (RFIN)(Vcc = +5 Vdc) +11 dBm ELECTROSTATIC SENSITIVE DEVICE 8 OBSERVE HANDLING PRECAUTIONS Junction Temperature 150 °C Continuous Pdiss (T = 85 °C) 0.536 W (derate 8.25 mW/°C above 85 °C) T Thermal Resistance 122 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C K - SM OC BL IN
Outline Drawing
A & G R E IV R - D S R IE NOTES: 1. PACKAGE BODY MATERIAL: IF MOLDING COMPOUND MP-180S OR EQUIVALENT. L 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. P 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] M 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. A 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H480 HMC480ST89 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H480 HMC480ST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Info F rmoatr pr ion f iurcne, de ished b ly iv A e n r al y o a g D n evd to p ices is bla eli c eve o ed t rde o be ras: H ccuratite tiatne M d reli iacr ble ow . Ho av wev e C er, n o o rpo Fora r t p iro ic n e ,, 2 d 0 eli A ve lrpha R y, and toad, C o place hoel rd m er s s fo : Ard, MA 01 nalog Devic 8 e 2 s 4 , Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rde hone r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .ehit r o t nilte in .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
8 - 125
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r app tion Su s p @ po h rt itt : P ite ho .c ne o : 1m -800-ANALOG-D