Datasheet HMC3653LP3BE (Analog Devices) - 5

HMC3653LP3BE
v02.0917
HBT GAIN BLOCK MMIC AMPLIFIER, 7 - 15 GHz 12-Lead Lead Frame Chip Scale Package [LFCSP] 3 x 3 mm Body and 0.85 mm Package Height (CP-12-10) Outline Drawing Dimensions shown in millimeters
T m
3.05 0.28 3.00 SQ
s
0.23 PIN 1 PIN 1 3.95 0.18 INDICATOR INDICATOR 0.43 × 0.43 10 12 0.50
er -
9 1 BSC 1.25
w
EXPOSED 1.15 SQ PAD 1.05 7 3
po
6 4 0.60 TOP VIEW BOTTOM VIEW 0.55 0.50
r &
0.90 1.00 REF
A
0.85 0.05 MAX 0.80 FOR PROPER CONNECTION OF
e
0.02 NOM THE EXPOSED PAD, REFER TO COPLANARITY THE PIN CONFIGURATION AND SEATING 0.08 FUNCTION DESCRIPTIONS PLANE 0.203 REF SECTION OF THIS DATA SHEET.
lin
PKG-004927 05-18-2017-A
s - 12-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.85 mm Package Height (CP-12-10) Dimensions shown in mil imeters plifier m A
Package Information
part number package Body material lead finish msl rating [2] package marking [1] H3653 HmC3653lp3Be roHs-compliant low stress injection molded plastic 100% matte sn msl1 XXXX [1] 4-Digit lot number XXXX [2] max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Second Harmonics vs. Pout Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Temperature @ Pout = 18 dBm Power Dissipation Power Compression @ 10 GHz Psat vs. Vdd P1dB vs. Vdd Psat vs. Temperature P1dB vs. Temperature Noise Figure vs. Frequency Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Gain & Return Loss Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit