Datasheet ADL5601 (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | 50 MHz TO 4.0 GHz RF/IF Gain Block |
| Páginas / Página | 16 / 7 — Data Sheet. ADL5601. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 323 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADL5601. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. ESD CAUTION
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Data Sheet ADL5601 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating
Stresses above those listed under Absolute Maximum Ratings Supply Voltage, V may cause permanent damage to the device. This is a stress CC 6.5 V Input Power (Referred to 50 Ω) rating only; functional operation of the device at these or any 16 dBm Internal Power Dissipation (Paddle Soldered) 600 mW other conditions above those indicated in the operational θ section of this specification is not implied. Exposure to absolute JA (Junction to Air) 30.7°C/W θ maximum rating conditions for extended periods may affect JC (Junction to Paddle) 5.0°C/W Maximum Junction Temperature 150°C device reliability. Lead Temperature (Soldering, 60 sec) 240°C Operating Temperature Range −40°C to +85°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Rev. A | Page 7 of 16 Document Outline Features Functional Block Diagram General Description Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Basic Connections Soldering Information and Recommended PCB Land Pattern W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
Stresses above those listed under Absolute Maximum Ratings Supply Voltage, V may cause permanent damage to the device. This is a stress CC 6.5 V Input Power (Referred to 50 Ω) rating only; functional operation of the device at these or any 16 dBm Internal Power Dissipation (Paddle Soldered) 600 mW other conditions above those indicated in the operational θ section of this specification is not implied. Exposure to absolute JA (Junction to Air) 30.7°C/W θ maximum rating conditions for extended periods may affect JC (Junction to Paddle) 5.0°C/W Maximum Junction Temperature 150°C device reliability. Lead Temperature (Soldering, 60 sec) 240°C Operating Temperature Range −40°C to +85°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Rev. A | Page 7 of 16 Document Outline Features Functional Block Diagram General Description Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Basic Connections Soldering Information and Recommended PCB Land Pattern W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide