Datasheet ADL5544 (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 30 MHz to 6 GHz RF/IF Gain Block |
| Páginas / Página | 20 / 8 — ADL5544. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. RFIN 1. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 393 Kb |
| Idioma del documento | Inglés |
ADL5544. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. RFIN 1. GND 2. TOP VIEW. (2) GND. (Not to Scale). RFOUT 3
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ADL5544 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 ADL5544 GND 2 TOP VIEW (2) GND (Not to Scale) RFOUT 3 NOTES 1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THE TAB AT THE TOP SIDE OF THE PACKAGE. SOLDER
002
THE EXPOSED PAD TO A LOW IMPEDANCE GROUND PLANE FOR ELECTRICAL GROUNDING AND
1384-
THERMAL TRANSFER.
1 Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. EPAD Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed pad to a low impedance ground plane for electrical grounding and thermal transfer. Rev. A | Page 8 of 20 Document Outline Features Functional Block Diagram General Description Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 500 MHz to 4 GHz Frequency Band 100 MHz to 500 MHz Frequency Band 4 GHz to 6 GHz Frequency Band General Applications Information Basic Connections Soldering Information and Recommended PCB Land Pattern Operation Down to 30 MHz W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
002
THE EXPOSED PAD TO A LOW IMPEDANCE GROUND PLANE FOR ELECTRICAL GROUNDING AND
1384-
THERMAL TRANSFER.
1 Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. EPAD Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed pad to a low impedance ground plane for electrical grounding and thermal transfer. Rev. A | Page 8 of 20 Document Outline Features Functional Block Diagram General Description Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 500 MHz to 4 GHz Frequency Band 100 MHz to 500 MHz Frequency Band 4 GHz to 6 GHz Frequency Band General Applications Information Basic Connections Soldering Information and Recommended PCB Land Pattern Operation Down to 30 MHz W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide