Datasheet ADL5610 (Analog Devices) - 10
| Fabricante | Analog Devices |
| Descripción | 30 MHz to 6 GHz RF/IF Gain Block |
| Páginas / Página | 16 / 10 — ADL5610. Data Sheet. 30 MHz TO 500 MHz FREQUENCY BAND. ) m 40. , dB. OIP3 … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 558 Kb |
| Idioma del documento | Inglés |
ADL5610. Data Sheet. 30 MHz TO 500 MHz FREQUENCY BAND. ) m 40. , dB. OIP3 (dBm). 3 (dB. 350MHz. , OIP 1dB 25. 30MHz. , P. dBm) 30. P1dB (dBm)
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ADL5610 Data Sheet 30 MHz TO 500 MHz FREQUENCY BAND 45 45 ) m 40 , dB 40 35 OIP3 (dBm) 3 (dB 350MHz 30 35 , OIP 1dB 25 30MHz , P dBm) 30 IN P1dB (dBm) 20 IP3 ( 140MHz O E, GA GAIN (dB) 15 R 25 10 E FIGU 20 OIS 5 N NOISE FIGURE (dB) 0 15 0 50 100 150 200 250 300 350 400 450 500
109
–4 –2 0 2 4 6
112
FREQUENCY (MHz)
11507-
POUT PER TONE (dBm)
11507- Figure 9. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency, Figure 12. OIP3 vs. Output Power (POUT) and Frequency, Low Frequency Configuration Low Frequency Configuration
25 0 –5 20 ) –10 B S22 15 +105°C S (d dB) –15 ER S11 N ( +85°C AI +25°C MET G A –20 10 –40°C R S12 S-PA –25 5 –30 0 –35 0 50 100 150 200 250 300 350 400 450 500
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0 50 100 150 200 250 300 350 400 450 500
113
FREQUENCY (MHz)
11507-
FREQUENCY (MHz)
11507- Figure 10. Gain vs. Frequency and Temperature, Figure 13. Output Return Loss (S22), Input Return Loss (S11), and Low Frequency Configuration Reverse Isolation (S12) vs. Frequency, Low Frequency Configuration
45 45 8 40 40 7 35 35 6 ) 30 30 5 +105°C E (dB 25 25 R dBm) –40°C dBm) +25°C +85°C 4 –40°C IP3 ( 20 20 B ( +25°C O +105°C P1d E FIGU 3 +85°C 15 15 OIS N 10 10 2 5 5 1 0 0 0 0 50 100 150 200 250 300 350 400 450 500
111
0 50 100 150 200 250 300 350 400 450 500
114
FREQUENCY (MHz)
11507-
FREQUENC Y (MHz)
11507- Figure 11. OIP3 and P1dB vs. Frequency and Temperature, Figure 14. Noise Figure vs. Frequency and Temperature, Low Frequency Configuration Low Frequency Configuration Rev. B | Page 10 of 16 Document Outline Features Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 500 MHz to 6 GHz Frequency Band 30 MHz to 500 MHz Frequency Band General Applications Information Basic Connections Soldering Information and Recommended PCB Land Pattern W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
109
–4 –2 0 2 4 6
112
FREQUENCY (MHz)
11507-
POUT PER TONE (dBm)
11507- Figure 9. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency, Figure 12. OIP3 vs. Output Power (POUT) and Frequency, Low Frequency Configuration Low Frequency Configuration
25 0 –5 20 ) –10 B S22 15 +105°C S (d dB) –15 ER S11 N ( +85°C AI +25°C MET G A –20 10 –40°C R S12 S-PA –25 5 –30 0 –35 0 50 100 150 200 250 300 350 400 450 500
110
0 50 100 150 200 250 300 350 400 450 500
113
FREQUENCY (MHz)
11507-
FREQUENCY (MHz)
11507- Figure 10. Gain vs. Frequency and Temperature, Figure 13. Output Return Loss (S22), Input Return Loss (S11), and Low Frequency Configuration Reverse Isolation (S12) vs. Frequency, Low Frequency Configuration
45 45 8 40 40 7 35 35 6 ) 30 30 5 +105°C E (dB 25 25 R dBm) –40°C dBm) +25°C +85°C 4 –40°C IP3 ( 20 20 B ( +25°C O +105°C P1d E FIGU 3 +85°C 15 15 OIS N 10 10 2 5 5 1 0 0 0 0 50 100 150 200 250 300 350 400 450 500
111
0 50 100 150 200 250 300 350 400 450 500
114
FREQUENCY (MHz)
11507-
FREQUENC Y (MHz)
11507- Figure 11. OIP3 and P1dB vs. Frequency and Temperature, Figure 14. Noise Figure vs. Frequency and Temperature, Low Frequency Configuration Low Frequency Configuration Rev. B | Page 10 of 16 Document Outline Features Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 500 MHz to 6 GHz Frequency Band 30 MHz to 500 MHz Frequency Band General Applications Information Basic Connections Soldering Information and Recommended PCB Land Pattern W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide