Datasheet IRF820, SiHF820 (Vishay) - 2

FabricanteVishay
DescripciónPower MOSFET
Páginas / Página9 / 2 — IRF820, SiHF820. THERMAL RESISTANCE RATINGS. PARAMETER SYMBOL. TYP. MAX. …
RevisiónC
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Idioma del documentoInglés

IRF820, SiHF820. THERMAL RESISTANCE RATINGS. PARAMETER SYMBOL. TYP. MAX. UNIT. SPECIFICATIONS. TEST. CONDITIONS MIN. Static. Dynamic

IRF820, SiHF820 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP MAX UNIT SPECIFICATIONS TEST CONDITIONS MIN Static Dynamic

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IRF820, SiHF820
Vishay Siliconix
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient RthJA - 62 Case-to-Sink, Flat, Greased Surface RthCS 0.50 - °C/W Maximum Junction-to-Case (Drain) RthJC - 2.5
SPECIFICATIONS
(TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static
Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 μA 500 - - V VDS Temperature Coefficient VDS/TJ Reference to 25 °C, ID = 1 mA - 0.59 - V/°C Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 μA 2.0 - 4.0 V Gate-Source Leakage IGSS VGS = ± 20 V - - ± 100 nA VDS = 500 V, VGS = 0 V - - 25 Zero Gate Voltage Drain Current IDSS μA VDS = 400 V, VGS = 0 V, TJ = 125 °C - - 250 Drain-Source On-State Resistance RDS(on) VGS = 10 V ID = 1.5 Ab - - 3.0 Forward Transconductance gfs VDS = 50 V, ID = 1.5 A 1.5 - - S
Dynamic
Input Capacitance Ciss - 360 - VGS = 0 V, Output Capacitance Coss VDS = 25 V, - 92 - pF f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance Crss - 37 - Total Gate Charge Qg - - 24 I Gate-Source Charge Qgs V D = 2.1 A, VDS = 400 V, GS = 10 V - - 3.3 nC see fig. 6 and 13b Gate-Drain Charge Qgd - - 13 Turn-On Delay Time td(on) - 8.0 - Rise Time tr V - 8.6 - DD = 250 V, ID = 2.1 A, ns Rg = 18 , RD = 100 , see fig. 10b Turn-Off Delay Time td(off) - 33 - Fall Time tf - 16 - Between lead, D Internal Drain Inductance LD - 4.5 - 6 mm (0.25") from package and center of nH G die contact Internal Source Inductance LS - 7.5 - S
Drain-Source Body Diode Characteristics
MOSFET symbol Continuous Source-Drain Diode Current I D S - - 2.5 showing the integral reverse A G Pulsed Diode Forward Currenta I p - n junction diode SM - - 8.0 S Body Diode Voltage VSD TJ = 25 °C, IS = 2.5 A, VGS = 0 Vb - - 1.6 V Body Diode Reverse Recovery Time trr - 260 520 ns TJ = 25 °C, IF = 2.1 A, dI/dt = 100 A/s Body Diode Reverse Recovery Charge Qrr - 0.7 1.4 nC Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width  300 μs; duty cycle  2 %. www.vishay.com Document Number: 91059 2 S11-0507-Rev. C, 21-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000