Datasheet ADM3053 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | Signal and Power Isolated CAN Transceiver with Integrated Isolated DC-to-DC Converter |
| Páginas / Página | 18 / 4 — ADM3053. Data Sheet. TIMING SPECIFICATIONS. Table 2. Parameter. Symbol … |
| Revisión | E |
| Formato / tamaño de archivo | PDF / 527 Kb |
| Idioma del documento | Inglés |
ADM3053. Data Sheet. TIMING SPECIFICATIONS. Table 2. Parameter. Symbol Min Typ. Max. Unit. Test Conditions/Comments
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ADM3053 Data Sheet TIMING SPECIFICATIONS
All voltages are relative to their respective ground; 3.0 V ≤ VIO ≤ 5.5 V; 4.5 V ≤ VCC ≤ 5.5 V. TA = −40°C to +85°C, unless otherwise noted.
Table 2. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER Maximum Data Rate 1 Mbps Propagation Delay from TxD On to Bus Active tonTxD 90 ns RS = 0 Ω; see Figure 2 and Figure 24 RL = 60 Ω, CL = 100 pF Propagation Delay from TxD Off to Bus Inactive toffTxD 120 ns RS = 0 Ω; see Figure 2 and Figure 24 RL = 60 Ω, CL = 100 pF RECEIVER Propagation Delay from TxD On to Receiver Active tonRxD 200 ns RS = 0 Ω; see Figure 2 630 ns RS = 47 kΩ; see Figure 2 Propagation Delay from TxD Off to Receiver Inactive1 toffRxD 250 ns RS = 0 Ω; see Figure 2 480 ns RS = 47 kΩ; see Figure 2 CANH, CANL SLEW RATE |SR| 7 V/µs RS = 47 kΩ 1 Guaranteed by design and characterization.
SWITCHING CHARACTERISTICS VIO 0.7VIO VTxD 0.25VIO 0V VOD VDIFF = VCANH – VCANL VDIFF 0.9V 0.5V VOR tonTxD toffTxD VIO VIO – 0.3V VRxD 0.4V
002
0V tonRxD toffRxD
09293- Figure 2. Driver Propagation Delay, Rise/Fall Timing
VRxD HIGH LOW VHYS
004
0.5 0.9 VID (V)
09293- Figure 3. Receiver Input Hysteresis Rev. E | Page 4 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS SWITCHING CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS VDE 0884 INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS CIRCUIT DESCRIPTION CAN TRANSCEIVER OPERATION SIGNAL ISOLATION POWER ISOLATION TRUTH TABLES THERMAL SHUTDOWN DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY APPLICATIONS INFORMATION PCB LAYOUT EMI CONSIDERATIONS RS PIN INSULATION LIFETIME TYPICAL APPLICATIONS OUTLINE DIMENSIONS ORDERING GUIDE
ADM3053 Data Sheet TIMING SPECIFICATIONS
All voltages are relative to their respective ground; 3.0 V ≤ VIO ≤ 5.5 V; 4.5 V ≤ VCC ≤ 5.5 V. TA = −40°C to +85°C, unless otherwise noted.
Table 2. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER Maximum Data Rate 1 Mbps Propagation Delay from TxD On to Bus Active tonTxD 90 ns RS = 0 Ω; see Figure 2 and Figure 24 RL = 60 Ω, CL = 100 pF Propagation Delay from TxD Off to Bus Inactive toffTxD 120 ns RS = 0 Ω; see Figure 2 and Figure 24 RL = 60 Ω, CL = 100 pF RECEIVER Propagation Delay from TxD On to Receiver Active tonRxD 200 ns RS = 0 Ω; see Figure 2 630 ns RS = 47 kΩ; see Figure 2 Propagation Delay from TxD Off to Receiver Inactive1 toffRxD 250 ns RS = 0 Ω; see Figure 2 480 ns RS = 47 kΩ; see Figure 2 CANH, CANL SLEW RATE |SR| 7 V/µs RS = 47 kΩ 1 Guaranteed by design and characterization.
SWITCHING CHARACTERISTICS VIO 0.7VIO VTxD 0.25VIO 0V VOD VDIFF = VCANH – VCANL VDIFF 0.9V 0.5V VOR tonTxD toffTxD VIO VIO – 0.3V VRxD 0.4V
002
0V tonRxD toffRxD
09293- Figure 2. Driver Propagation Delay, Rise/Fall Timing
VRxD HIGH LOW VHYS
004
0.5 0.9 VID (V)
09293- Figure 3. Receiver Input Hysteresis Rev. E | Page 4 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS SWITCHING CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS VDE 0884 INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS CIRCUIT DESCRIPTION CAN TRANSCEIVER OPERATION SIGNAL ISOLATION POWER ISOLATION TRUTH TABLES THERMAL SHUTDOWN DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY APPLICATIONS INFORMATION PCB LAYOUT EMI CONSIDERATIONS RS PIN INSULATION LIFETIME TYPICAL APPLICATIONS OUTLINE DIMENSIONS ORDERING GUIDE