Datasheet LTM4700 (Analog Devices) - 4

LTM4700
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) Terminal Voltages:
TOP VIEW V + − INn (Note 4), SVIN, IIN , IIN .. –0.3V to 18V 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SW0, SW1 .. −1V to 18V, −5V to 25V Transient GND GND GND A V GND GND GND OUTn .. –0.3V to 3.6V B INTV GND GND GND CC, VBIAS .. –0.3V to 6V C V + + VIN1 GND GND GND VOUT1 OSNS0 , VOSNS1 ... –0.3V to 6V D V − − GND GND GND OSNS0 , VOSNS1 .. –0.3V to 0.3V E RUNn, SDA, SCL, ALERT ... –0.3V to 5.5V SW1 GND GND GND F F GND VDD25 GND GND GND TSNS1b SWPH_CFG, VOUTn_CFG, VTRIMn_CFG, ASEL ...–0.3V to 2.75V G FAULTn, SYNC, SHARE_CLK, WP, VTRIM1_CFGVOUT1_CFG ASEL FAULT1 FAULT0 SDA H PGOOD0, PGOOD1 .. −0.3V to 3.6V WP VTRIM0_CFGVOUT0_CFGFSWPH_CFGRUN0 ALERT SCL J (SV + – SHARE_CLK VDD33 GND GND RUN1 TSNS0a SYNC IN – IN+), (IIN – IIN ) ... –0.3V to +0.3V K COMPna, COMPnb, .. –0.3V to 2.7V COMP1a COMP1b TSNS1a GND GND L TSNS0a, TSNS1a .. –0.3V to 2.2V GND V – + OSNS1 VOSNS1 SGND COMP0b GND GND M TSNS0b, TSNS1b .. –0.3V to 0.8V GND PGOOD1 GND GND GND COMP0a V – OSNS0 N + RUNP .. –0.3V to SV GND GND GND GND GND IIN– VOSNS0 IN P GND INTVCC GND GND IIN+ PGOOD0
Temperatures
R GND GND VBIAS GND GND TSNS0b Internal Operating Temperature Range T GND GND GND (Notes 2, 13, 17, 18) ... –40°C to 125°C U SW0 VIN0 SVIN GND GND VOUT0 Storage Temperature Range .. –55°C to 125°C V GND GND GND Peak Solder Reflow Package Body Temperature ... 245°C W GND RUNP GND Y GND GND GND AA GND GND GND AB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 BGA PACKAGE 330-PIN (15mm × 22mm × 7.87mm) TJMAX = 125°C, θJCtop = 3.1°C/W, θJCbottom = 1°C/W, θJB = 1.75°C/W, θJA = 8.5°C/W θ VALUES DETERMINED PER JESD51-12 WEIGHT = 9.5g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4700EY#PBF LTM4700Y SAC305 (RoHS) e4 BGA 4 –40°C to 125°C LTM4700IY#PBF LTM4700Y LTM4700IY SnPb (63/37) LTM4700Y e0 BGA 4 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev 0 4 For more information www.analog.com Document Outline Features Applications Typical Application Description Table of Contents Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Functional Diagram Test Circuits Operation PMBus Command Summary Applications Information Applications Information-Derating Curves Typical Applications PMBus Command Details Package Description Typical Applications Package Photograph Related Parts Features Applications Typical Application Description Table of Contents Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Functional Diagram Test Circuits Operation Power Module Introduction Power Module Overview, Major Features EEPROM with ECC Power-Up and Initialization Soft-Start Time-Based Sequencing Voltage-Based Sequencing Shutdown Light-Load Current Operation Switching Frequency and Phase PWM Loop Compensation Output Voltage Sensing INTVCC and Build-in 5V Bias Converter Output Current Sensing and Sub Milliohm DCR Current Sensing Input Current Sensing PolyPhase Load Sharing External/Internal Temperature Sense RCONFIG (Resistor Configuration) Pins Fault Detection and Handling Status Registers and ALERT Masking Mapping Faults to FAULT Pins Power Good Pins CRC Protection Serial Interface Communication Protection Device Addressing Responses to VOUT and IIN/IOUT Faults Output Overvoltage Fault Response Output Undervoltage Response Peak Output Overcurrent Fault Response Responses to Timing Faults Responses to VIN OV Faults Responses to OT/UT Faults Internal Overtemperature Fault Response External Overtemperature and Undertemperature Fault Response Responses to Input Overcurrent and Output Undercurrent Faults Responses to External Faults Fault Logging Bus Timeout Protection Similarity Between PMBus, SMBus and I2C 2-Wire Interface PMBus Serial Digital Interface Figures 7 to 24 PMBus Protocols PMBus Command Summary PMBus Commands Applications Information VIN to VOUT Step-Down Ratios Input Capacitors Output Capacitors Light Load Current Operation Switching Frequency and Phase Output Current Limit Programming Minimum On-Time Considerations Variable Delay Time, Soft-Start and Output Voltage Ramping Digital Servo Mode Soft Off (Sequenced Off) Undervoltage Lockout Fault Detection and Handling Open-Drain Pins Phase-Locked Loop and Frequency Synchronization Input Current Sense Amplifier Programmable Loop Compensation Checking Transient Response PolyPhase Configuration Connecting The USB to I2C/SMBus/PMBus Controller to the LTM4700 In System LTpowerPlay: An Interactive GUI for Digital Power PMBus Communication and Command Processing Thermal Considerations and Output Current Derating Applications Information-Derating Curves EMI Performance Safety Considerations Layout Checklist/Example Typical Applications PMBus Command Details Addressing and Write Protect General Configuration Commands On/Off/Margin PWM Configuration Voltage Input Voltage and Limits Output Voltage and Limits Output Current and Limits Input Current and Limits Temperature External Temperature Calibration Timing Timing—On Sequence/Ramp Timing—Off Sequence/Ramp Precondition for Restart Fault Response Fault Responses All Faults Fault Responses Input Voltage Fault Responses Output Voltage Fault Responses Output Current Fault Responses IC Temperature Fault Responses External Temperature Fault Sharing Fault Sharing Propagation Fault Sharing Response Scratchpad Identification Fault Warning and Status Telemetry NVM Memory Commands Store/Restore Fault Logging Block Memory Write/Read Package Description Typical Applications Package Photograph Related Parts