Datasheet ADP5023 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | Dual 3 MHz, 800 mA Buck Regulator with One 300 mA LDO |
| Páginas / Página | 28 / 6 — ADP5023. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| Revisión | E |
| Formato / tamaño de archivo | PDF / 892 Kb |
| Idioma del documento | Inglés |
ADP5023. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 6. Parameter. Rating. Table 7. Thermal Resistance
Versión de texto del documento
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ADP5023 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 6. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AVIN to AGND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. VIN1, VIN2 to AVIN −0.3 V to +0.3 V
Table 7. Thermal Resistance
PGND1, PGND2 to AGND −0.3 V to +0.3 V
Package Type θJA θJC Unit
VIN3, VOUT1, VOUT2, FB1, FB2, FB3, −0.3 V to (AVIN + 0.3 V) EN1, EN2, EN3, MODE to AGND 24-Lead, 0.5 mm pitch LFCSP 35 3 °C/W VOUT3 to AGND −0.3 V to (VIN3 + 0.3 V) SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V)
ESD CAUTION
SW2 to PGND2 −0.3 V to (VIN2 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature −40°C to +125°C Range Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. D | Page 6 of 28 Document Outline Features Applications General Description Typical Application Circuit Revision History Specifications General Specifications BUCK1 and BUCK2 Specifications LDO Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Management Unit Thermal Protection Undervoltage Lockout Enable/Shutdown BUCK1 and BUCK2 Control Scheme PWM Mode Power Save Mode (PSM) PSM Current Threshold Oscillator/Phasing of Inductor Switching Short-Circuit Protection Soft Start Current Limit 100% Duty Operation Active Pull-Downs LDO Applications Information Buck External Component Selection Feedback Resistors Inductor Output Capacitor Input Capacitor LDO External Component Selection Feedback Resistors Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Power Dissipation and Thermal Considerations Buck Regulator Power Dissipation LDO Regulator Power Dissipation Junction Temperature PCB Layout Guidelines Typical Application Schematics Bill of Materials Outline Dimensions Ordering Guide
ADP5023 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 6. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AVIN to AGND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. VIN1, VIN2 to AVIN −0.3 V to +0.3 V
Table 7. Thermal Resistance
PGND1, PGND2 to AGND −0.3 V to +0.3 V
Package Type θJA θJC Unit
VIN3, VOUT1, VOUT2, FB1, FB2, FB3, −0.3 V to (AVIN + 0.3 V) EN1, EN2, EN3, MODE to AGND 24-Lead, 0.5 mm pitch LFCSP 35 3 °C/W VOUT3 to AGND −0.3 V to (VIN3 + 0.3 V) SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V)
ESD CAUTION
SW2 to PGND2 −0.3 V to (VIN2 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature −40°C to +125°C Range Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. D | Page 6 of 28 Document Outline Features Applications General Description Typical Application Circuit Revision History Specifications General Specifications BUCK1 and BUCK2 Specifications LDO Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Management Unit Thermal Protection Undervoltage Lockout Enable/Shutdown BUCK1 and BUCK2 Control Scheme PWM Mode Power Save Mode (PSM) PSM Current Threshold Oscillator/Phasing of Inductor Switching Short-Circuit Protection Soft Start Current Limit 100% Duty Operation Active Pull-Downs LDO Applications Information Buck External Component Selection Feedback Resistors Inductor Output Capacitor Input Capacitor LDO External Component Selection Feedback Resistors Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Power Dissipation and Thermal Considerations Buck Regulator Power Dissipation LDO Regulator Power Dissipation Junction Temperature PCB Layout Guidelines Typical Application Schematics Bill of Materials Outline Dimensions Ordering Guide