Datasheet ADP5135 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | Triple 1800 mA Buck Regulators With Precision Enables and Power Good Outputs |
| Páginas / Página | 24 / 5 — Data Sheet. ADP5135. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL … |
| Formato / tamaño de archivo | PDF / 795 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADP5135. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE. Parameter Rating. Table 6. Thermal Resistance
Línea de modelo para esta hoja de datos
Versión de texto del documento
link to page 21 link to page 21
Data Sheet ADP5135 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AVIN to AGND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. VIN1, VIN2, VIN3 to AVIN −0.3 V to +0.3 V
Table 6. Thermal Resistance
PGND1, PGND2, PGND3 to AGND −0.3 V to +0.3 V
Package Type θ
VOUT1, VOUT2, VOUT3, FB1, FB2, FB3, −0.3 V to (AVIN + 0.3 V)
JA θJC Unit
EN1, EN2, EN3, MODE, PG1, PG2, PG3 24-Lead LFCSP 35 3 °C/W to AGND SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V) SW2 to PGND2 −0.3 V to (VIN2 + 0.3 V)
ESD CAUTION
SW3 to PGND3 −0.3 V to (VIN3 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. 0 | Page 5 of 24 Document Outline Features Applications Typical Application Circuit General Description Revision History Specifications BUCK1, BUCK2, and BUCK3 Input and Output Capacitors, Recommended Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Management Unit Power-Good Output Thermal Protection Undervoltage Lockout Precision Enable and Shutdown Control Buck Regulators: BUCK1, BUCK2, AND BUCK3 Control Scheme PWM Mode Power Save Mode (PSM) PSM Current Threshold Oscillator/Phasing of Inductor Switching Short-Circuit Protection Buck Regulator Soft Start Current Limit 100% Duty Operation Active Pull-Down Resistors Applications Information Buck External Component Selection Feedback Resistors Inductor Output Capacitor Input Capacitor Typical Application Schematics Power Dissipation and Thermal Considerations Buck Regulator Power Dissipation Junction Temperature PCB Layout Guidelines Outline Dimensions Ordering Guide
Data Sheet ADP5135 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AVIN to AGND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. VIN1, VIN2, VIN3 to AVIN −0.3 V to +0.3 V
Table 6. Thermal Resistance
PGND1, PGND2, PGND3 to AGND −0.3 V to +0.3 V
Package Type θ
VOUT1, VOUT2, VOUT3, FB1, FB2, FB3, −0.3 V to (AVIN + 0.3 V)
JA θJC Unit
EN1, EN2, EN3, MODE, PG1, PG2, PG3 24-Lead LFCSP 35 3 °C/W to AGND SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V) SW2 to PGND2 −0.3 V to (VIN2 + 0.3 V)
ESD CAUTION
SW3 to PGND3 −0.3 V to (VIN3 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. 0 | Page 5 of 24 Document Outline Features Applications Typical Application Circuit General Description Revision History Specifications BUCK1, BUCK2, and BUCK3 Input and Output Capacitors, Recommended Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Management Unit Power-Good Output Thermal Protection Undervoltage Lockout Precision Enable and Shutdown Control Buck Regulators: BUCK1, BUCK2, AND BUCK3 Control Scheme PWM Mode Power Save Mode (PSM) PSM Current Threshold Oscillator/Phasing of Inductor Switching Short-Circuit Protection Buck Regulator Soft Start Current Limit 100% Duty Operation Active Pull-Down Resistors Applications Information Buck External Component Selection Feedback Resistors Inductor Output Capacitor Input Capacitor Typical Application Schematics Power Dissipation and Thermal Considerations Buck Regulator Power Dissipation Junction Temperature PCB Layout Guidelines Outline Dimensions Ordering Guide