Datasheet LT1178, LT1179 (Analog Devices) - 10
| Fabricante | Analog Devices |
| Descripción | 17µA Max, Dual and Quad, Single Supply, Precision Op Amps |
| Páginas / Página | 12 / 10 — PACKAGE DESCRIPTIO. H Package. 8-Lead TO-5 Metal Can (.230 Inch PCD). J8 … |
| Formato / tamaño de archivo | PDF / 247 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTIO. H Package. 8-Lead TO-5 Metal Can (.230 Inch PCD). J8 Package. 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
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LT1178/LT1179
U PACKAGE DESCRIPTIO H Package 8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321) .016 – .021** (0.406 – 0.533) .027 – .045 .335 – .370 (0.686 – 1.143) (8.509 – 9.398) 45°TYP PIN 1 DIA .028 – .034 .305 – .335 (0.711 – 0.864) (7.747 – 8.509) .040 .230 (1.016) .050 (5.842) MAX (1.270) .165 – .185 TYP MAX (4.191 – 4.699) REFERENCE SEATING PLANE .110 – .160 PLANE GAUGE (2.794 – 4.064) PLANE .500 – .750 (12.700 – 19.050) INSULATING .010 – .045* STANDOFF (0.254 – 1.143) *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND THE SEATING PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H8 (TO-5) 0.230 PCD 0801
J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .405 (10.287) .200 .005 .300 BSC MAX CORNER LEADS OPTION (5.080) (0.127) (7.62 BSC) (4 PLCS) MAX MIN 8 7 6 5 .015 – .060 .023 – .045 (0.381 – 1.524) .025 .220 – .310 (0.584 – 1.143) (0.635) HALF LEAD (5.588 – 7.874) RAD TYP .008 – .018 OPTION 0° – 15° (0.203 – 0.457) .045 – .068 (1.143 – 1.650) 1 2 3 4 FULL LEAD .045 – .065 OPTION .125 (1.143 – 1.651) 3.175 NOTE: LEAD DIMENSIONS APPLY TO SOLDER MIN .014 – .026 DIP/PLATE OR TIN PLATE LEADS .100 (0.360 – 0.660) (2.54) J8 0801 BSC
J Package 14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .200 .300 BSC (5.080) (7.62 BSC) MAX .785 (19.939) .015 – .060 .005 MAX (0.381 – 1.524) (0.127) MIN 14 13 12 11 10 9 8 .008 – .018 0° – 15° (0.203 – 0.457) .025 .220 – .310 (0.635) (5.588 – 7.874) .045 – .065 .100 .125 RAD TYP (1.143 – 1.651) (2.54) (3.175) NOTE: LEAD DIMENSIONS APPLY BSC .014 – .026 MIN TO SOLDER DIP/PLATE OR TIN 1 2 3 4 5 6 7 PLATE LEADS (0.360 – 0.660) J14 0801
OBSOLETE PACKAGES
11789fb 10
U PACKAGE DESCRIPTIO H Package 8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321) .016 – .021** (0.406 – 0.533) .027 – .045 .335 – .370 (0.686 – 1.143) (8.509 – 9.398) 45°TYP PIN 1 DIA .028 – .034 .305 – .335 (0.711 – 0.864) (7.747 – 8.509) .040 .230 (1.016) .050 (5.842) MAX (1.270) .165 – .185 TYP MAX (4.191 – 4.699) REFERENCE SEATING PLANE .110 – .160 PLANE GAUGE (2.794 – 4.064) PLANE .500 – .750 (12.700 – 19.050) INSULATING .010 – .045* STANDOFF (0.254 – 1.143) *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND THE SEATING PLANE .016 – .024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610) H8 (TO-5) 0.230 PCD 0801
J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .405 (10.287) .200 .005 .300 BSC MAX CORNER LEADS OPTION (5.080) (0.127) (7.62 BSC) (4 PLCS) MAX MIN 8 7 6 5 .015 – .060 .023 – .045 (0.381 – 1.524) .025 .220 – .310 (0.584 – 1.143) (0.635) HALF LEAD (5.588 – 7.874) RAD TYP .008 – .018 OPTION 0° – 15° (0.203 – 0.457) .045 – .068 (1.143 – 1.650) 1 2 3 4 FULL LEAD .045 – .065 OPTION .125 (1.143 – 1.651) 3.175 NOTE: LEAD DIMENSIONS APPLY TO SOLDER MIN .014 – .026 DIP/PLATE OR TIN PLATE LEADS .100 (0.360 – 0.660) (2.54) J8 0801 BSC
J Package 14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .200 .300 BSC (5.080) (7.62 BSC) MAX .785 (19.939) .015 – .060 .005 MAX (0.381 – 1.524) (0.127) MIN 14 13 12 11 10 9 8 .008 – .018 0° – 15° (0.203 – 0.457) .025 .220 – .310 (0.635) (5.588 – 7.874) .045 – .065 .100 .125 RAD TYP (1.143 – 1.651) (2.54) (3.175) NOTE: LEAD DIMENSIONS APPLY BSC .014 – .026 MIN TO SOLDER DIP/PLATE OR TIN 1 2 3 4 5 6 7 PLATE LEADS (0.360 – 0.660) J14 0801
OBSOLETE PACKAGES
11789fb 10