Datasheet LT2178, LT2179 (Analog Devices) - 10

FabricanteAnalog Devices
Descripción17µA Max, Dual and Quad, Single Supply, Precision Op Amps
Páginas / Página12 / 10 — PACKAGE DESCRIPTION. S8 Package. 8-Lead Plastic Small Outline (Narrow …
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Idioma del documentoInglés

PACKAGE DESCRIPTION. S8 Package. 8-Lead Plastic Small Outline (Narrow 0.150). S Package

PACKAGE DESCRIPTION S8 Package 8-Lead Plastic Small Outline (Narrow 0.150) S Package

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LT2178/LT2179
PACKAGE DESCRIPTION S8 Package 8-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 05-08-1610) .189 – .197 .045 p (4.801 – 5.004) .050 BSC NOTE 3 8 7 6 5 .245 MIN .160 p .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 p TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 s 45o .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0o– 8o TYP (0.101 – 0.254) (0.203 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 2. DRAWING NOT TO SCALE MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303
S Package 14-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 05-08-1610) .337 – .344 .045 p (8.560 – 8.738) .050 BSC NOTE 3 14 13 12 11 10 9 8 N N .245 MIN .160 p .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 1 2 3 N/2 N/2 .030 p TYP RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 .010 – .020 s 45o .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .008 – .010 .004 – .010 (0.203 – 0.254) 0o – 8o TYP (0.101 – 0.254) .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) TYP BSC NOTE: INCHES 1. DIMENSIONS IN (MILLIMETERS) 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 2. DRAWING NOT TO SCALE MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) S14 0502 21789fc 10