Datasheet ADuM3190S (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | Aerospace High Stability Isolated Error Amplifier |
| Páginas / Página | 14 / 8 — 6.0 MIL-PRF-38535 QMLV Exceptions. 7.0 Application Notes |
| Revisión | C |
| Formato / tamaño de archivo | PDF / 1.1 Mb |
| Idioma del documento | Inglés |
6.0 MIL-PRF-38535 QMLV Exceptions. 7.0 Application Notes
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control and shall be made available to the preparing and acquiring activity upon request. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition A.
6.0 MIL-PRF-38535 QMLV Exceptions
6.1. Wafer Fabrication Wafer fabrication occurs at MIL-PRF-38535 QML Class Q certified facility. 6.2. Wafer Lot Acceptance (WLA) WLA per MIL-STD-883 TM 5007 is not available for this product. SEM inspection per MIL-STD-883 TM2018 is not applicable to the ADuM3190S. The wafer fabrication process is manufactured using planarized metallization 6.3. Device contains bi-metallic wire bonds (Gold bond wires on Aluminum die pads).
7.0 Application Notes
TEST CIRCUITS
6.0 MIL-PRF-38535 QMLV Exceptions
6.1. Wafer Fabrication Wafer fabrication occurs at MIL-PRF-38535 QML Class Q certified facility. 6.2. Wafer Lot Acceptance (WLA) WLA per MIL-STD-883 TM 5007 is not available for this product. SEM inspection per MIL-STD-883 TM2018 is not applicable to the ADuM3190S. The wafer fabrication process is manufactured using planarized metallization 6.3. Device contains bi-metallic wire bonds (Gold bond wires on Aluminum die pads).
7.0 Application Notes
TEST CIRCUITS