Datasheet LTM8021 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 36VIN, 500mA Step-Down DC/DC µModule |
| Páginas / Página | 18 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). TOP VIEW. orDer … |
| Formato / tamaño de archivo | PDF / 388 Kb |
| Idioma del documento | Inglés |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). TOP VIEW. orDer inForMaTion PART NUMBER. PAD OR BALL FINISH. PART MARKING*
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LTM8021
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V
TOP VIEW
IN, RUN/SS Voltage ...40V RUN/SS Above VIN ..3V 5 ADJ Voltage ..5V VIN V BANK 1 OUT BANK 2 BIAS Voltage ...7V 4 VOUT Voltage ...10V 3 BIAS Internal Operating Temperature ADJ Range (Note 2) ... –40°C to 125°C 2 GND RUN/SS BANK 3 Maximum Solder Temperature ..260°C 1 Storage Temperature Range .. –55°C to 125°C A B C D E F G H LGA PACKAGE 35-LEAD (11.25mm × 6.25mm × 2.82mm) TJMAX = 125°C, θJA = 36.9°C/W, θJB = 20.9°C/W, WEIGHT = 0.49g θJC(TOP) = 41.74°C/W, θJC(BOTTOM) = 17.8°C/W
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM8021EV#PBF Au (RoHS) LTM8021V e4 LGA 3 –40°C to 125°C LTM8021IV#PBF Au (RoHS) LTM8021V e4 LGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging
elecTrical characTerisTics The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C, VIN = 10V, VRUN/SS = 10V, VBIAS = 3V, RADJ = 31.6k. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN Input DC Voltage VRUN/SS = 5V, RADJ = Open 3 36 V VOUT Output DC Voltage 0 < IOUT < 500mA; RADJ Open 0.8 V 0 < IOUT < 500mA; RADJ = 19.1k, 0.1% 5 V RADJ(MIN) Minimum Allowable RADJ Note 3 18 kW ILK Leakage from IN to OUT RUN/SS = VBIAS = 0V, RADJ Open 2.7 6 µA IOUT Continuous Output DC Current 5V ≤ VIN ≤ 36V, VBIAS = VOUT 0 500 mA IQ(VIN) Quiescent Current into VIN RUN/SS = 0.2V, VBIAS, RADJ Open 0.1 1 µA Not Switching 1.5 2.5 mA IQ(BIAS) Quiescent Current into BIAS Not Switching 0.15 µA ∆VOUT/VOUT Line Regulation 5V ≤ VIN ≤ 36V, IOUT = 500mA 0.5 % RADJ = Open ∆VOUT/VOUT Load Regulation VIN = 24V, 0 ≤ IOUT ≤ 500mA, VBIAS = VOUT 0.35 % 8021fd 2 For more information www.linear.com/LTM8021 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Package Photo Typical Application Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V
TOP VIEW
IN, RUN/SS Voltage ...40V RUN/SS Above VIN ..3V 5 ADJ Voltage ..5V VIN V BANK 1 OUT BANK 2 BIAS Voltage ...7V 4 VOUT Voltage ...10V 3 BIAS Internal Operating Temperature ADJ Range (Note 2) ... –40°C to 125°C 2 GND RUN/SS BANK 3 Maximum Solder Temperature ..260°C 1 Storage Temperature Range .. –55°C to 125°C A B C D E F G H LGA PACKAGE 35-LEAD (11.25mm × 6.25mm × 2.82mm) TJMAX = 125°C, θJA = 36.9°C/W, θJB = 20.9°C/W, WEIGHT = 0.49g θJC(TOP) = 41.74°C/W, θJC(BOTTOM) = 17.8°C/W
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM8021EV#PBF Au (RoHS) LTM8021V e4 LGA 3 –40°C to 125°C LTM8021IV#PBF Au (RoHS) LTM8021V e4 LGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging
elecTrical characTerisTics The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C, VIN = 10V, VRUN/SS = 10V, VBIAS = 3V, RADJ = 31.6k. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN Input DC Voltage VRUN/SS = 5V, RADJ = Open 3 36 V VOUT Output DC Voltage 0 < IOUT < 500mA; RADJ Open 0.8 V 0 < IOUT < 500mA; RADJ = 19.1k, 0.1% 5 V RADJ(MIN) Minimum Allowable RADJ Note 3 18 kW ILK Leakage from IN to OUT RUN/SS = VBIAS = 0V, RADJ Open 2.7 6 µA IOUT Continuous Output DC Current 5V ≤ VIN ≤ 36V, VBIAS = VOUT 0 500 mA IQ(VIN) Quiescent Current into VIN RUN/SS = 0.2V, VBIAS, RADJ Open 0.1 1 µA Not Switching 1.5 2.5 mA IQ(BIAS) Quiescent Current into BIAS Not Switching 0.15 µA ∆VOUT/VOUT Line Regulation 5V ≤ VIN ≤ 36V, IOUT = 500mA 0.5 % RADJ = Open ∆VOUT/VOUT Load Regulation VIN = 24V, 0 ≤ IOUT ≤ 500mA, VBIAS = VOUT 0.35 % 8021fd 2 For more information www.linear.com/LTM8021 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Package Photo Typical Application Related Parts