Datasheet LTM4608A (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | Low VIN, 8A DC/DC μModule Regulator with Tracking, Margining, and Frequency Synchronization |
| Páginas / Página | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION. … |
| Formato / tamaño de archivo | PDF / 714 Kb |
| Idioma del documento | Inglés |
ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
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LTM4608A
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, SVIN .. –0.3V to 6V Internal Operating Temperature Range CLKOUT ... –0.3V to 2V (Note 2) .. –55°C to 125°C PGOOD, PLLLPF, CLKIN, PHMODE, MODE . –0.3V to VIN Storage Temperature Range .. –55°C to 125°C ITH, ITHM, RUN, FB, TRACK,MGN, BSEL .. –0.3V to VIN Peak Solder Reflow Body Temperature ... 245°C VOUT, SW .. –0.3V to (VIN + 0.3V)
PIN CONFIGURATION
TOP VIEW TOP VIEW A B C D E F G A B C D E F G GND VIN GND GND VIN GND 1 1 RUN RUN SGND 2 SGND 2 SW CLKOUT SW CLKOUT 3 3 CLKIN PLLLPF CLKIN PLLLPF 4 4 PHMODE SVIN PHMODE SVIN 5 5 MODE ITHM ITHM TRACK MODE TRACK 6 PGOOD 6 PGOOD FB I I BSEL TH FB TH 7 BSEL 7 MGN MGN 8 8 9 9 10 10 11 11 GND VOUT GND VOUT BGA PACKAGE LGA PACKAGE 68-LEAD (15mm × 9mm × 3.42mm) 68-LEAD (15mm × 9mm × 2.82mm) TJMAX = 125°C, θJA = 25°C/W, θJCbottom = 7°C/W, θJCtop = 50°C/W, WEIGHT = 1.1g TJMAX = 125°C, θJA = 25°C/W, θJCbottom = 7°C/W, θJCtop = 50°C/W, WEIGHT = 1.0g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4608AEV#PBF LTM4608AV –40°C to 125°C LTM4608AIV#PBF Au (RoHS) LTM4608AV e4 LGA 3 LTM4608AMPV#PBF LTM4608AMPV –55°C to 125°C LTM4608AEY#PBF LTM4608AY –40°C to 125°C LTM4608AIY#PBF SAC305 (RoHS) LTM4608AY e1 BGA 3 LTM4608AMPY#PBF LTM4608AY –55°C to 125°C LTM4608AMPY SnPb (63/37) LTM4608AY e0 • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Device temperature grade is indicated by a label on the shipping • LGA and BGA Package and Tray Drawings: www.linear.com/packaging container. • Terminal Finish Part Marking: www.linear.com/leadfree 4608afe 2 For more information www.linear.com/LTM4608A Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Order Information Typical Performance Characteristics Pin Functions Simplified Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Package Description Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, SVIN .. –0.3V to 6V Internal Operating Temperature Range CLKOUT ... –0.3V to 2V (Note 2) .. –55°C to 125°C PGOOD, PLLLPF, CLKIN, PHMODE, MODE . –0.3V to VIN Storage Temperature Range .. –55°C to 125°C ITH, ITHM, RUN, FB, TRACK,MGN, BSEL .. –0.3V to VIN Peak Solder Reflow Body Temperature ... 245°C VOUT, SW .. –0.3V to (VIN + 0.3V)
PIN CONFIGURATION
TOP VIEW TOP VIEW A B C D E F G A B C D E F G GND VIN GND GND VIN GND 1 1 RUN RUN SGND 2 SGND 2 SW CLKOUT SW CLKOUT 3 3 CLKIN PLLLPF CLKIN PLLLPF 4 4 PHMODE SVIN PHMODE SVIN 5 5 MODE ITHM ITHM TRACK MODE TRACK 6 PGOOD 6 PGOOD FB I I BSEL TH FB TH 7 BSEL 7 MGN MGN 8 8 9 9 10 10 11 11 GND VOUT GND VOUT BGA PACKAGE LGA PACKAGE 68-LEAD (15mm × 9mm × 3.42mm) 68-LEAD (15mm × 9mm × 2.82mm) TJMAX = 125°C, θJA = 25°C/W, θJCbottom = 7°C/W, θJCtop = 50°C/W, WEIGHT = 1.1g TJMAX = 125°C, θJA = 25°C/W, θJCbottom = 7°C/W, θJCtop = 50°C/W, WEIGHT = 1.0g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4608AEV#PBF LTM4608AV –40°C to 125°C LTM4608AIV#PBF Au (RoHS) LTM4608AV e4 LGA 3 LTM4608AMPV#PBF LTM4608AMPV –55°C to 125°C LTM4608AEY#PBF LTM4608AY –40°C to 125°C LTM4608AIY#PBF SAC305 (RoHS) LTM4608AY e1 BGA 3 LTM4608AMPY#PBF LTM4608AY –55°C to 125°C LTM4608AMPY SnPb (63/37) LTM4608AY e0 • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Device temperature grade is indicated by a label on the shipping • LGA and BGA Package and Tray Drawings: www.linear.com/packaging container. • Terminal Finish Part Marking: www.linear.com/leadfree 4608afe 2 For more information www.linear.com/LTM4608A Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Order Information Typical Performance Characteristics Pin Functions Simplified Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Package Description Related Parts