Datasheet LTM4613 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | EN55022B Compliant 36VIN, 15VOUT, 8A, DC/DC µModule Regulator |
| Páginas / Página | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION … |
| Formato / tamaño de archivo | PDF / 648 Kb |
| Idioma del documento | Inglés |
ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. ORDER INFORMATION http://www.linear.com/product/LTM4613#orderinfo
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ABSOLUTE MAXIMUM RATINGS (Note 1)
INTVCC, DRVCC ... –0.3V to 6V VIN, VD ...–0.3V to 36V VOUT ... –0.3V to 16V Internal Operating Temperature Range (Note 2) PLLIN, FCB, TRACK/SS, MPGM, MARG0, E- and I-Grades .. –40°C to 125°C MARG1, PGOOD ..–0.3V to INTVCC + 0.3V MP-Grade .. –55°C to 125°C RUN ...–0.3V to 5V Storage Temperature Range .. –55°C to 125°C VFB, COMP .. –0.3V to 2.7V Peak Solder Reflow Package Body Temperature ... 245°C
PIN CONFIGURATION
TOP VIEW TOP VIEW V CC V CC V D INT PLLIN TRACK/SS RUN COMP MPGM V D INT PLLIN TRACK/SS RUN COMP MPGM V A A IN VIN BANK 1 B V fSET BANK 1 B fSET D V C MARG0 D SGND C MARG0 SGND D MARG1 D MARG1 E DRVCC E DRV PGND CC PGND F VFB BANK 2 F VFB BANK 2 G PGOOD G PGOOD H SGND H SGND J NC J NC VOUT K NC VOUT K NC BANK 3 L NC BANK 3 L NC M FCB M FCB 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 LGA PACKAGE BGA PACKAGE 133-LEAD (15mm × 15mm × 4.32mm) 133-LEAD (15mm × 15mm × 4.92mm) TJMAX = 125°C, θJCtop = 17°C/w, θJCbottom = 2.3°C/W, θJA = 10°C/W, θJB = 2.5°C/W, TJMAX = 125°C, θJCtop = 17°C/w, θJCbottom = 2.3°C/W, θJA = 10°C/W, θJB = 2.5°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 2.5g WEIGHT = 2.7g
ORDER INFORMATION http://www.linear.com/product/LTM4613#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4613EV#PBF Au (RoHS) LTM4613V e4 LGA 3 –40°C to 125°C LTM4613IV#PBF Au (RoHS) LTM4613V e4 LGA 3 –40°C to 125°C LTM4613MPV#PBF Au (RoHS) LTM4613V e4 LGA 3 –55°C to 125°C LTM4613EY#PBF SAC305 (RoHS) LTM4613Y e1 BGA 3 –40°C to 125°C LTM4613IY#PBF SAC305 (RoHS) LTM4613Y e1 BGA 3 –40°C to 125°C LTM4613IY SnPb (63/37) LTM4613Y e0 BGA 3 –40°C to 125°C LTM4613MPY#PBF SAC305 (RoHS) LTM4613Y e1 BGA 3 –55°C to 125°C LTM4613MPY SnPb (63/37) LTM4613Y e0 BGA 3 –55°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree 4613fd 2 For more information www.linear.com/LTM4613 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Photograph Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
INTVCC, DRVCC ... –0.3V to 6V VIN, VD ...–0.3V to 36V VOUT ... –0.3V to 16V Internal Operating Temperature Range (Note 2) PLLIN, FCB, TRACK/SS, MPGM, MARG0, E- and I-Grades .. –40°C to 125°C MARG1, PGOOD ..–0.3V to INTVCC + 0.3V MP-Grade .. –55°C to 125°C RUN ...–0.3V to 5V Storage Temperature Range .. –55°C to 125°C VFB, COMP .. –0.3V to 2.7V Peak Solder Reflow Package Body Temperature ... 245°C
PIN CONFIGURATION
TOP VIEW TOP VIEW V CC V CC V D INT PLLIN TRACK/SS RUN COMP MPGM V D INT PLLIN TRACK/SS RUN COMP MPGM V A A IN VIN BANK 1 B V fSET BANK 1 B fSET D V C MARG0 D SGND C MARG0 SGND D MARG1 D MARG1 E DRVCC E DRV PGND CC PGND F VFB BANK 2 F VFB BANK 2 G PGOOD G PGOOD H SGND H SGND J NC J NC VOUT K NC VOUT K NC BANK 3 L NC BANK 3 L NC M FCB M FCB 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 LGA PACKAGE BGA PACKAGE 133-LEAD (15mm × 15mm × 4.32mm) 133-LEAD (15mm × 15mm × 4.92mm) TJMAX = 125°C, θJCtop = 17°C/w, θJCbottom = 2.3°C/W, θJA = 10°C/W, θJB = 2.5°C/W, TJMAX = 125°C, θJCtop = 17°C/w, θJCbottom = 2.3°C/W, θJA = 10°C/W, θJB = 2.5°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 2.5g WEIGHT = 2.7g
ORDER INFORMATION http://www.linear.com/product/LTM4613#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4613EV#PBF Au (RoHS) LTM4613V e4 LGA 3 –40°C to 125°C LTM4613IV#PBF Au (RoHS) LTM4613V e4 LGA 3 –40°C to 125°C LTM4613MPV#PBF Au (RoHS) LTM4613V e4 LGA 3 –55°C to 125°C LTM4613EY#PBF SAC305 (RoHS) LTM4613Y e1 BGA 3 –40°C to 125°C LTM4613IY#PBF SAC305 (RoHS) LTM4613Y e1 BGA 3 –40°C to 125°C LTM4613IY SnPb (63/37) LTM4613Y e0 BGA 3 –40°C to 125°C LTM4613MPY#PBF SAC305 (RoHS) LTM4613Y e1 BGA 3 –55°C to 125°C LTM4613MPY SnPb (63/37) LTM4613Y e0 BGA 3 –55°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree 4613fd 2 For more information www.linear.com/LTM4613 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Photograph Related Parts