Datasheet LTM4637 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 20A DC/DC µModule Step-Down Regulator |
| Páginas / Página | 30 / 2 — absoluTe MaxiMuM raTings (Note 1). pin conFiguraTion. orDer inForMaTion. … |
| Formato / tamaño de archivo | PDF / 624 Kb |
| Idioma del documento | Inglés |
absoluTe MaxiMuM raTings (Note 1). pin conFiguraTion. orDer inForMaTion. PART NUMBER. PAD OR BALL FINISH. PART MARKING*. PACKAGE. MSL
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LTM4637
absoluTe MaxiMuM raTings (Note 1)
VIN ... –0.3V to 22V TEMP .. –0.3V to 0.8V VOUT ... –0.3V to 6V INTVCC Peak Output Current (Note 6) ..100mA INTVCC, VOUT_LCL, PGOOD, EXTVCC .. –0.3V to 6V Internal Operating Temperature Range MODE_PLLIN, fSET, TRACK/SS, (Note 2) .. –40°C to 125°C V – + OSNS , VOSNS , DIFF_OUT ... –0.3V to INTVCC Storage Temperature Range .. –55°C to 125°C VFB, COMP (Note 7) ... –0.3V to 2.7V Reflow (Peak Body) Temperature .. 245°C RUN (Note 5) ... –0.3V to 5V
pin conFiguraTion
TOP VIEW TOP VIEW MODE_PLLIN MODE_PLLIN V INTVCC TRACK/SS COMP INTVCC TRACK/SS COMP IN VIN 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 A A RUN RUN VIN B f V SET IN B fSET C C INTVCC INTVCC D D TEMP TEMP E EXTVCC E EXTVCC PGOOD PGOOD F VFB F VFB GND GND G PGOOD G PGOOD H SGND H SGND J V + + OSNS J VOSNS K DIFF_OUT K DIFF_OUT VOUT VOUT L VOUT_LCL L VOUT_LCL M V – – OSNS M VOSNS LGA PACKAGE BGA PACKAGE 133-LEAD (15mm × 15mm × 4.32mm) 133-LEAD (15mm × 15mm × 4.92mm) TJ(MAX) = 125°C, θJA = 9.5°C/W, θJCbottom = 4°C/W, θJCtop = 6.7°C/W, θJB = 4.5°C/W TJ(MAX) = 125°C, θJA = 10.4°C/W, θJCbottom = 4.6°C/W, θJCtop = 6.7°C/W, θJB = 5.3°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS; WEIGHT = 2.9g θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS; WEIGHT = 3.1g θ VALUES DETERMINED PER JESD51-12 θ VALUES DETERMINED PER JESD51-12
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4637EV#PBF Au (RoHS) LTM4637V e4 LGA 4 –40°C to 125°C LTM4637IV#PBF Au (RoHS) LTM4637V e4 LGA 4 –40°C to 125°C LTM4637EY#PBF SAC305 (RoHS) LTM4637Y e1 BGA 4 –40°C to 125°C LTM4637IY#PBF SAC305 (RoHS) LTM4637Y e1 BGA 4 –40°C to 125°C LTM4637IY SnPb (63/37) LTM4637Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4637fc 2 For more information www.linear.com/LTM4637 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package PHOTO Typical Application Related Parts Design Resources
absoluTe MaxiMuM raTings (Note 1)
VIN ... –0.3V to 22V TEMP .. –0.3V to 0.8V VOUT ... –0.3V to 6V INTVCC Peak Output Current (Note 6) ..100mA INTVCC, VOUT_LCL, PGOOD, EXTVCC .. –0.3V to 6V Internal Operating Temperature Range MODE_PLLIN, fSET, TRACK/SS, (Note 2) .. –40°C to 125°C V – + OSNS , VOSNS , DIFF_OUT ... –0.3V to INTVCC Storage Temperature Range .. –55°C to 125°C VFB, COMP (Note 7) ... –0.3V to 2.7V Reflow (Peak Body) Temperature .. 245°C RUN (Note 5) ... –0.3V to 5V
pin conFiguraTion
TOP VIEW TOP VIEW MODE_PLLIN MODE_PLLIN V INTVCC TRACK/SS COMP INTVCC TRACK/SS COMP IN VIN 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 A A RUN RUN VIN B f V SET IN B fSET C C INTVCC INTVCC D D TEMP TEMP E EXTVCC E EXTVCC PGOOD PGOOD F VFB F VFB GND GND G PGOOD G PGOOD H SGND H SGND J V + + OSNS J VOSNS K DIFF_OUT K DIFF_OUT VOUT VOUT L VOUT_LCL L VOUT_LCL M V – – OSNS M VOSNS LGA PACKAGE BGA PACKAGE 133-LEAD (15mm × 15mm × 4.32mm) 133-LEAD (15mm × 15mm × 4.92mm) TJ(MAX) = 125°C, θJA = 9.5°C/W, θJCbottom = 4°C/W, θJCtop = 6.7°C/W, θJB = 4.5°C/W TJ(MAX) = 125°C, θJA = 10.4°C/W, θJCbottom = 4.6°C/W, θJCtop = 6.7°C/W, θJB = 5.3°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS; WEIGHT = 2.9g θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS; WEIGHT = 3.1g θ VALUES DETERMINED PER JESD51-12 θ VALUES DETERMINED PER JESD51-12
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4637EV#PBF Au (RoHS) LTM4637V e4 LGA 4 –40°C to 125°C LTM4637IV#PBF Au (RoHS) LTM4637V e4 LGA 4 –40°C to 125°C LTM4637EY#PBF SAC305 (RoHS) LTM4637Y e1 BGA 4 –40°C to 125°C LTM4637IY#PBF SAC305 (RoHS) LTM4637Y e1 BGA 4 –40°C to 125°C LTM4637IY SnPb (63/37) LTM4637Y e0 BGA 4 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4637fc 2 For more information www.linear.com/LTM4637 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package PHOTO Typical Application Related Parts Design Resources