Datasheet LTM4624 (Analog Devices) - 3

FabricanteAnalog Devices
Descripción14VIN, 4A Step-Down DC/DC µModule Regulator
Páginas / Página26 / 3 — ELECTRICAL CHARACTERISTICS. The. denotes the specifications which apply …
Formato / tamaño de archivoPDF / 350 Kb
Idioma del documentoInglés

ELECTRICAL CHARACTERISTICS. The. denotes the specifications which apply over the full internal

ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full internal

Línea de modelo para esta hoja de datos

Versión de texto del documento

LTM4624
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = SVIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
ΔVOUT (Line)/VOUT Line Regulation Accuracy VOUT = 1.5V, VIN = 4V to 14V, IOUT = 0A l 0.04 0.15 %/V ΔVOUT (Load)/VOUT Load Regulation Accuracy VOUT = 1.5V, IOUT = 0A to 4A l 1 1.5 % VOUT(AC) Output Ripple Voltage IOUT = 0A, COUT = 100µF Ceramic, VIN = 12V, 5 mV VOUT = 1.5V ΔVOUT(START) Turn-On Overshoot IOUT = 0A, COUT = 100µF Ceramic, VIN = 12V, 30 mV VOUT = 1.5V tSTART Turn-On Time COUT = 100µF Ceramic, No Load, TRACK/SS = 0.01µF, VIN 2.5 ms = 12V, VOUT = 1.5V ΔVOUTLS Peak Deviation for Dynamic Load: 0% to 50% to 0% of Full Load, COUT = 47µF 160 mV Load Ceramic, VIN = 12V, VOUT = 1.5V tSETTLE Settling Time for Dynamic Load: 0% to 50% to 0% of Full Load, COUT = 47µF 40 µs Load Step Ceramic, VIN = 12V, VOUT = 1.5V IOUTPK Output Current Limit VIN = 12V, VOUT = 1.5V 5 7 A VFB Voltage at FB Pin IOUT = 0A, VOUT = 1.5V 0.594 0.60 0.606 V IOUT = 0A, VOUT = 1.5V, –40°C to 125°C l 0.591 0.60 0.609 V IFB Current at FB Pin (Note 4) ±30 nA RFBHI Resistor Between VOUT and 60.05 60.40 60.75 kΩ FB Pins ITRACK/SS Track Pin Soft-Start Pull-Up TRACK/SS = 0V 2.5 4 µA Current VIN(UVLO) VIN Undervoltage Lockout VIN Falling 2.4 2.6 2.8 V VIN Hysteresis 350 mV tON(MIN) Minimum On-Time (Note 4) 40 ns tOFF(MIN) Minimum Off-Time (Note 4) 70 ns VPGOOD PGOOD Trip Level VFB With Respect to Set Output VFB Ramping Negative –13 –10 –7 % VFB Ramping Positive 7 10 13 % IPGOOD PGOOD Leakage 2 µA VPGL PGOOD Voltage Low IPGOOD = 1mA 0.02 0.1 V VINTVCC Internal VCC Voltage SVIN = 4V to 14V 3.2 3.3 3.4 V VINTVCC Load Reg INTVCC Load Regulation ICC = 0mA to 20mA 0.5 % fOSC Oscillator Frequency 1 MHz
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
See output current derating curves for different VIN, VOUT and TA. may cause permanent damage to the device. Exposure to any Absolute
Note 4:
100% tested at wafer level. Maximum Rating condition for extended periods may affect device
Note 5:
This IC includes overtemperature protection that is intended reliability and lifetime. to protect the device during momentary overload conditions. Junction
Note 2:
The LTM4624 is tested under pulsed load conditions such that temperature will exceed 125°C when overtemperature protection is active. TJ ≈ TA. The LTM4624E is guaranteed to meet performance specifications Continuous operation above the specified maximum operating junction over the 0°C to 125°C internal operating temperature range. Specifications temperature may impair device reliability. over the –40°C to 125°C internal operating temperature range are assured by design, characterization and correlation with statistical process controls. The LTM4624I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal resistance and other environmental factors. 4624fd For more information www.linear.com/LTM4624 3 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Package Photo Design Resources Related Parts