Datasheet LTM4648 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | Low VIN, 10A Step-Down μModule Regulator |
| Páginas / Página | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 1.7 Mb |
| Idioma del documento | Inglés |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
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LTM4648
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW VIN ... –0.3V to 6V A B C D E F G VOUT, INTVCC, PGOOD, RUN (Note 5) .. –0.3V to 6V GND V GND IN MODE, CLKIN, TRACK/SS, DIFFP, DIFFN, 1 CLKOUT DIFFOUT, PHASMD ...–0.3V to INTV 2 CC CLKIN NC FREQ V 3 FB .. –0.3V to 2.7V PHMODE COMP (Note 6) .. –0.3V to 2.7V 4 MODE TRACK/SS INTVCC Peak Output Current (Note 6) ..100mA 5 Internal Operating Temperature Range SW TEMP 6 COMP NC FB DIFFN (Note 2) .. –55°C to 125°C 7 Storage Temperature Range .. –55°C to 125°C PGOOD DIFFP 8 DIFFOUT Peak Solder Reflow Body Temperature ... 245°C 9 VOUT_LCL 10 11 GND VOUT BGA PACKAGE 68-LEAD (9mm × 15mm × 4.92mm) TJMAX = 125°C, θJA = 14°C/W, θJCbottom = 5°C/W, θJCtop = 20°C/W WEIGHT = 1.0g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4648EY#PBF LTM4648Y SAC305 (RoHS) e1 LTM4648IY#PBF LTM4648Y BGA 3 –40°C to 125°C LTM4648IY SnPb (63/37) LTM4648Y e0 • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev A 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Design Resources Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Typical Application Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW VIN ... –0.3V to 6V A B C D E F G VOUT, INTVCC, PGOOD, RUN (Note 5) .. –0.3V to 6V GND V GND IN MODE, CLKIN, TRACK/SS, DIFFP, DIFFN, 1 CLKOUT DIFFOUT, PHASMD ...–0.3V to INTV 2 CC CLKIN NC FREQ V 3 FB .. –0.3V to 2.7V PHMODE COMP (Note 6) .. –0.3V to 2.7V 4 MODE TRACK/SS INTVCC Peak Output Current (Note 6) ..100mA 5 Internal Operating Temperature Range SW TEMP 6 COMP NC FB DIFFN (Note 2) .. –55°C to 125°C 7 Storage Temperature Range .. –55°C to 125°C PGOOD DIFFP 8 DIFFOUT Peak Solder Reflow Body Temperature ... 245°C 9 VOUT_LCL 10 11 GND VOUT BGA PACKAGE 68-LEAD (9mm × 15mm × 4.92mm) TJMAX = 125°C, θJA = 14°C/W, θJCbottom = 5°C/W, θJCtop = 20°C/W WEIGHT = 1.0g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4648EY#PBF LTM4648Y SAC305 (RoHS) e1 LTM4648IY#PBF LTM4648Y BGA 3 –40°C to 125°C LTM4648IY SnPb (63/37) LTM4648Y e0 • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev A 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Design Resources Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Revision History Typical Application Design Resources Related Parts