Datasheet LTM4650A-1 (Analog Devices) - 9
| Fabricante | Analog Devices |
| Descripción | Dual 25A or Single 50A DC/DC μModule Regulator with 1% DC Accuracy |
| Páginas / Página | 36 / 9 — PIN FUNCTIONS (Recommended to Use Test Points to Monitor Signal Pin … |
| Formato / tamaño de archivo | PDF / 1.3 Mb |
| Idioma del documento | Inglés |
PIN FUNCTIONS (Recommended to Use Test Points to Monitor Signal Pin Connections.) RUN1, RUN2 (F5, F9):. INTVCC (H8):
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LTM4650A-1
PIN FUNCTIONS (Recommended to Use Test Points to Monitor Signal Pin Connections.) RUN1, RUN2 (F5, F9):
Run Control Pin. A voltage above
INTVCC (H8):
Internal 5V Regulator Output. The control 1.25V will turn on each channel in the module. A voltage circuits and internal gate drivers are powered from this below 1.25V on the RUN pin will turn off the related chan- voltage. Decouple this pin to PGND with a 4.7µF low ESR nel. Each RUN pin has a 1µA pull-up current, once the tantalum or ceramic. INTVCC is activated when either RUN1 RUN pin reaches 1.2V an additional 4.5µA pull-up current or RUN2 is activated. is added to this pin.
TEMP (J6):
Temperature Monitor. An internal diode con-
DIFFOUT (F8):
Internal Remote Sense Amplifier Output. nected NPN transistor connected between TEMP and SGND Connect this pin to VOUTS1 or VOUTS2 depending on which pins. See the Applications Information section. output is using remote sense. In parallel operation con- nect one of the V
EXTVCC (J7):
External power input that is enabled through OUTS pin to DIFFOUT for remote sensing. a switch to INTVCC whenever EXTVCC is greater than 4.7V.
SW1, SW2 (G2, G11):
Switching node of each channel Do not exceed 6V on this input, and connect this pin to that is used for testing purposes. Also an R-C snubber VIN when operating VIN on 5V. An efficiency increase will network can be applied to reduce or eliminate switch node occur that is a function of the (VIN – INTVCC) multiplied by ringing, or otherwise leave floating. See the Applications power MOSFET driver current. Typical current requirement Information section. is 30mA. VIN must be applied before EXTVCC, and EXTVCC
PHASMD (G4):
Connect this pin to SGND, INTV must be removed before V CC, or float- IN. ing this pin to select the phase of CLKOUT to 60 degrees,
VIN (M2–M11, L2–L11, J2–J4, J9–J11, K2–K4, K9–K11):
120 degrees, and 90 degrees respectively. Power Input Pins. Apply input voltage between these pins
CLKOUT (G5):
Clock output with phase control using the and GND pins. Recommend placing input decoupling PHASMD pin to enable multiphase operation between capacitance directly between VIN pins and GND pins. devices. See the Applications Information section.
Heat Sink (Top Exposed Metal):
The top exposed metal
PGOOD1, PGOOD2 (G9, G8):
Output Voltage Power is electrically unconnected. Good Indicator. Open drain logic output that is pulled to ground when the output voltage is not within ±10% of the regulation point. 4650a1f For more information www.linear.com/LTM4650A-1 9 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Typical Application Package Photo Design Resources Related Parts
PIN FUNCTIONS (Recommended to Use Test Points to Monitor Signal Pin Connections.) RUN1, RUN2 (F5, F9):
Run Control Pin. A voltage above
INTVCC (H8):
Internal 5V Regulator Output. The control 1.25V will turn on each channel in the module. A voltage circuits and internal gate drivers are powered from this below 1.25V on the RUN pin will turn off the related chan- voltage. Decouple this pin to PGND with a 4.7µF low ESR nel. Each RUN pin has a 1µA pull-up current, once the tantalum or ceramic. INTVCC is activated when either RUN1 RUN pin reaches 1.2V an additional 4.5µA pull-up current or RUN2 is activated. is added to this pin.
TEMP (J6):
Temperature Monitor. An internal diode con-
DIFFOUT (F8):
Internal Remote Sense Amplifier Output. nected NPN transistor connected between TEMP and SGND Connect this pin to VOUTS1 or VOUTS2 depending on which pins. See the Applications Information section. output is using remote sense. In parallel operation con- nect one of the V
EXTVCC (J7):
External power input that is enabled through OUTS pin to DIFFOUT for remote sensing. a switch to INTVCC whenever EXTVCC is greater than 4.7V.
SW1, SW2 (G2, G11):
Switching node of each channel Do not exceed 6V on this input, and connect this pin to that is used for testing purposes. Also an R-C snubber VIN when operating VIN on 5V. An efficiency increase will network can be applied to reduce or eliminate switch node occur that is a function of the (VIN – INTVCC) multiplied by ringing, or otherwise leave floating. See the Applications power MOSFET driver current. Typical current requirement Information section. is 30mA. VIN must be applied before EXTVCC, and EXTVCC
PHASMD (G4):
Connect this pin to SGND, INTV must be removed before V CC, or float- IN. ing this pin to select the phase of CLKOUT to 60 degrees,
VIN (M2–M11, L2–L11, J2–J4, J9–J11, K2–K4, K9–K11):
120 degrees, and 90 degrees respectively. Power Input Pins. Apply input voltage between these pins
CLKOUT (G5):
Clock output with phase control using the and GND pins. Recommend placing input decoupling PHASMD pin to enable multiphase operation between capacitance directly between VIN pins and GND pins. devices. See the Applications Information section.
Heat Sink (Top Exposed Metal):
The top exposed metal
PGOOD1, PGOOD2 (G9, G8):
Output Voltage Power is electrically unconnected. Good Indicator. Open drain logic output that is pulled to ground when the output voltage is not within ±10% of the regulation point. 4650a1f For more information www.linear.com/LTM4650A-1 9 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Typical Application Package Photo Design Resources Related Parts