Datasheet LTM8001 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 36VIN, 5A μModule Regulator with 5-Output Configurable LDO Array |
| Páginas / Página | 28 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. … |
| Formato / tamaño de archivo | PDF / 400 Kb |
| Idioma del documento | Inglés |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Línea de modelo para esta hoja de datos
Versión de texto del documento
LTM8001
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V TOP VIEW IN0 ...40V VOUT4 SET4 VOUT3 SET3 SET2 V V OUT2 IN45, BIAS45 ...25V BIAS123 ..25V 11 VOUT5 VOUT1 FB0, RT, COMP, ILIM, V 10 REF ...3V SET5 V 9 SET1 OUT0-5 ...25V BIAS45 VREF RUN, SYNC, SS ...6V 8 ILIM BIAS123 SYNC SET1-5 (Relative to V 7 RT OUT1-5, Respectively) ..±0.3V VIN45 GND BANK 3 Current Into SET1-5 ... ±10mA 6 COMP BANK 2 Current Into RUN Pin ..100µA 5 FBO V SS OUT0 Maximum Junction Temperature (Notes 2, 3) ... 125°C 4 RUN BANK 4 Peak Solder Reflow Body Temperature ... 245°C 3 V Storage Temperature.. –55°C to 125°C 2 IN0 BANK 1 1 A B C D E F G H J K L BGA PACKAGE 121 PADS (15mm × 15mm × 3.42mm) TJMAX = 125°C, θJA = 16.1°C/W, θJCbottom = 5.99°C/W, θJCtop = 13.4°C/W, θJB = 4.98°C/W θ VALUES DETERMINED PER JEDEC 51-9, 51-12 WEIGHT = 1.8 GRAMS
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8001EY#PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 –40°C to 125°C LTM8001IY#PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 –40°C to 125°C LTM8001IY SnPb (63/37) LTM8001Y e0 BGA 3 –40°C to 125°C LTM8001MPY#PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 –55°C to 125°C LTM8001MPY SnPb (63/37) LTM8001Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8001fd 2 For more information www.linear.com/LTM8001 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V TOP VIEW IN0 ...40V VOUT4 SET4 VOUT3 SET3 SET2 V V OUT2 IN45, BIAS45 ...25V BIAS123 ..25V 11 VOUT5 VOUT1 FB0, RT, COMP, ILIM, V 10 REF ...3V SET5 V 9 SET1 OUT0-5 ...25V BIAS45 VREF RUN, SYNC, SS ...6V 8 ILIM BIAS123 SYNC SET1-5 (Relative to V 7 RT OUT1-5, Respectively) ..±0.3V VIN45 GND BANK 3 Current Into SET1-5 ... ±10mA 6 COMP BANK 2 Current Into RUN Pin ..100µA 5 FBO V SS OUT0 Maximum Junction Temperature (Notes 2, 3) ... 125°C 4 RUN BANK 4 Peak Solder Reflow Body Temperature ... 245°C 3 V Storage Temperature.. –55°C to 125°C 2 IN0 BANK 1 1 A B C D E F G H J K L BGA PACKAGE 121 PADS (15mm × 15mm × 3.42mm) TJMAX = 125°C, θJA = 16.1°C/W, θJCbottom = 5.99°C/W, θJCtop = 13.4°C/W, θJB = 4.98°C/W θ VALUES DETERMINED PER JEDEC 51-9, 51-12 WEIGHT = 1.8 GRAMS
orDer inForMaTion PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8001EY#PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 –40°C to 125°C LTM8001IY#PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 –40°C to 125°C LTM8001IY SnPb (63/37) LTM8001Y e0 BGA 3 –40°C to 125°C LTM8001MPY#PBF SAC305 (RoHS) LTM8001Y e1 BGA 3 –55°C to 125°C LTM8001MPY SnPb (63/37) LTM8001Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8001fd 2 For more information www.linear.com/LTM8001 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Related Parts