AD580ABSOLUTE MAXIMUM RATINGS Table 3.AD580 CHIP DIMENSIONS AND PAD LAYOUTParameter Rating Dimensions shown in inches and (millimeters). Input Voltage 40 V 0.075 (1.90) Power Dissipation @ 25°C Ambient Temperature 350 mW Derate above 25°C 2.8 mW/°C +E Lead Temperature (Soldering 300°C 10 sec) 0.046(1.16) Thermal Resistance Junction-to-Case 100°C Junction-to-Ambient 360°C/W –E -002 EOUT* Stresses above those listed under Absolute Maximum Ratings *BOTH EOUT PADS MUST BE CONNECTED TO THE OUTPUT. 00525-B may cause permanent damage to the device. This is a stress Figure 2. rating only; functional operation of the device at these or any The AD580 is also available in chip form. Consult the factory other conditions above those listed in the operational sections for specifications and applications information. of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. B | Page 4 of 8 Document Outline FEATURES GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS AD580 CHIP DIMENSIONS AND PAD LAYOUT ESD CAUTION THEORY OF OPERATION VOLTAGE VARIATION VERSUS TEMPERATURE NOISE PERFORMANCE THE AD580 AS A CURRENT LIMITER THE AD580 AS A LOW POWER, LOW VOLTAGE, PRECISION REFERENCE F OUTLINE DIMENSIONS ORDERING GUIDE