Datasheet HMC363 (Analog Devices) - 3

FabricanteAnalog Devices
DescripciónGaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz
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HMC363. GaAs HBT MMIC. DIVIDE-BY-8, DC - 12 GHz. Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C

HMC363 GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C

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HMC363
v04.0109
GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz
1
Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
300 RF Input (Vcc = +5V) +13 dBm IP Vcc +5.5V 200 H VLogic Vcc -1.6V to Vcc -1.2V 100 Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C 0 S - C R -100 AMPLITUDE (mV) E -200 ELECTROSTATIC SENSITIVE DEVICE ID OBSERVE HANDLING PRECAUTIONS -300 IV 22.7 23.1 23.5 23.9 24.3 24.7 TIME (nS) Y D
Typical Supply Current vs. Vcc
Vcc (V) Icc (mA) NC 4.75 64 E 5.0 70 U 5.25 75 Q Note: Divider will operate over full voltage range shown above E R F
Outline Drawing
NOTE:
Die Packaging Information
[1] 1. ALL DIMENSIONS IN INCHES (MILLIMETERS) 2. ALL TOLERANCES ARE ±0.001 (0.025) Standard Alternate 3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND WP-8 (Waffle Pack) [2] 4. BOND PADS ARE 0.004 (0.100) SQAURE [1] Refer to the “Packaging Information” section for die 5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150) packaging dimensions. 6. BACKSIDE METALLIZATION: GOLD [2] For alternate packaging information contact Hittite 7. BOND PAD METALLIZATION: GOLD Microwave Corporation. Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
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