Datasheet ADF5000 (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | 4 GHz TO 18 GHz Divide-by-2 Prescaler |
| Páginas / Página | 12 / 7 — Data Sheet. ADF5000. EVALUATION BOARD PCB. PCB MATERIAL STACK-UP. 1.5oz … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 220 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADF5000. EVALUATION BOARD PCB. PCB MATERIAL STACK-UP. 1.5oz (53µm) FINISHED COPPER. ROGERS RO4003C LAMINATE 0.008”
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Data Sheet ADF5000 EVALUATION BOARD PCB
The evaluation board has four connectors as shown in Figure 8.
PCB MATERIAL STACK-UP
The RF input connector (J4) is a high frequency precision SMA The evaluation board is built using Rogers RO4003C material connector from Emerson. This connector is mechanically (0.008 inch). RF track widths are 0.015 inch to achieve a control ed compatible with SMA, 3.5 mm, and 2.92 mm cables. 50 Ω characteristic impedance. The complete printed circuit board (PCB) stack-up is shown in Figure 9.
1.5oz (53µm) FINISHED COPPER ROGERS RO4003C LAMINATE 0.008” εr = 3.38. STARTING COPPER WEIGHT 0.5oz/0.5oz 0.5oz (18µm) FINISHED COPPER 0.062” ± 0.003” FR4 PREPREG COPPER TO COPPER 0.0372”
008 09129- Figure 8. Evaluation Board Silkscreen—Top View
0.5oz (18µm) FINISHED COPPER
The evaluation board is powered from a single 3.0 V to 3.6 V
ROGERS RO4003C LAMINATE 0.008”
supply, which should be connected to the J1 SMA connector.
εr = 3.38. STARTING COPPER WEIGHT 0.5oz/0.5oz
The power supply can also be connected using the T3 (VDDx) 009 and T2 (GND) test points.
1.5oz (53µm) FINISHED COPPER
09129- The differential RF outputs are brought out on the J2 and J3 Figure 9. Evaluation Board PCB Layer Stack-Up SMA connectors. If only one of the outputs is being used, the unused output should be correctly terminated using a 50 Ω SMA termination. The chip enable (CE) pin can be controlled using the T1 test point. If this function is not required, the test point can be left unconnected.
BILL OF MATERIALS Table 4. Qty. Reference Designator Description Supplier Part Number
1 C1 0.1 µF, 0603 capacitor Murata GRM188R71H104KA93D 1 C2 10 pF, 0402 capacitor Murata GRM1555C1H100JZ01D 3 J1, J2, J3 SMA RF connector Emerson 142-0701-851 1 J4 SMA RF connector Emerson 142-0761-801 3 T1, T2, T3 Test points Vero 20-2137 1 U1 ADF5000 RF prescaler Analog Devices, Inc. ADF5000BCPZ Rev. A | Page 7 of 12 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Evaluation Board PCB PCB Material Stack-Up Bill of Materials Application Circuit Outline Dimensions Ordering Guide
Data Sheet ADF5000 EVALUATION BOARD PCB
The evaluation board has four connectors as shown in Figure 8.
PCB MATERIAL STACK-UP
The RF input connector (J4) is a high frequency precision SMA The evaluation board is built using Rogers RO4003C material connector from Emerson. This connector is mechanically (0.008 inch). RF track widths are 0.015 inch to achieve a control ed compatible with SMA, 3.5 mm, and 2.92 mm cables. 50 Ω characteristic impedance. The complete printed circuit board (PCB) stack-up is shown in Figure 9.
1.5oz (53µm) FINISHED COPPER ROGERS RO4003C LAMINATE 0.008” εr = 3.38. STARTING COPPER WEIGHT 0.5oz/0.5oz 0.5oz (18µm) FINISHED COPPER 0.062” ± 0.003” FR4 PREPREG COPPER TO COPPER 0.0372”
008 09129- Figure 8. Evaluation Board Silkscreen—Top View
0.5oz (18µm) FINISHED COPPER
The evaluation board is powered from a single 3.0 V to 3.6 V
ROGERS RO4003C LAMINATE 0.008”
supply, which should be connected to the J1 SMA connector.
εr = 3.38. STARTING COPPER WEIGHT 0.5oz/0.5oz
The power supply can also be connected using the T3 (VDDx) 009 and T2 (GND) test points.
1.5oz (53µm) FINISHED COPPER
09129- The differential RF outputs are brought out on the J2 and J3 Figure 9. Evaluation Board PCB Layer Stack-Up SMA connectors. If only one of the outputs is being used, the unused output should be correctly terminated using a 50 Ω SMA termination. The chip enable (CE) pin can be controlled using the T1 test point. If this function is not required, the test point can be left unconnected.
BILL OF MATERIALS Table 4. Qty. Reference Designator Description Supplier Part Number
1 C1 0.1 µF, 0603 capacitor Murata GRM188R71H104KA93D 1 C2 10 pF, 0402 capacitor Murata GRM1555C1H100JZ01D 3 J1, J2, J3 SMA RF connector Emerson 142-0701-851 1 J4 SMA RF connector Emerson 142-0761-801 3 T1, T2, T3 Test points Vero 20-2137 1 U1 ADF5000 RF prescaler Analog Devices, Inc. ADF5000BCPZ Rev. A | Page 7 of 12 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Evaluation Board PCB PCB Material Stack-Up Bill of Materials Application Circuit Outline Dimensions Ordering Guide