25 /10 — 120. 300. 100. 200. µV ( E. LTAG. nA). V T E. -100. -20. OFF. -200. -40. …
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2017-12-21
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PDF / 2.0 Mb
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120. 300. 100. 200. µV ( E. LTAG. nA). V T E. -100. -20. OFF. -200. -40. -60. -300. -15. -10. COMMON MODE VOLTAGE (V). 250. IB+. IB-. (nA). 150. T N. CURRENT (nA). CURR
ISL70444SEH Typical Performance Curves Unless otherwise specified, VS ± 18V, VCM = 0, VO = 0V, TA = +25°C. 120300100)20080µV ( E6010040LTAGnA)O(020 S V T E I BIA 0S-100-20OFF-200-40-60-300-20-15-10-505101520-20-15-10-505101520COMMON MODE VOLTAGE (V)COMMON MODE VOLTAGE (V) FIGURE 3. OFFSET VOLTAGE vs COMMON-MODE VOLTAGE FIGURE 4. IBIAS vs COMMON-MODE VOLTAGE 300250IB+250200200IB+IB-(nA)150T N150E100100IB-CURRENT (nA)CURR505000-100-50050100150-100-50050100150TEMPERATURE (°C)TEMPERATURE (°C) FIGURE 5. IBIAS vs TEMPERATURE (VS = ±18V) FIGURE 6. IBIAS vs TEMPERATURE (VS = ±2.5V) 3002.5IB+2502.0200(nA) 1.5T (nA)IB-NI150NTOSERE 1.0100CURRCUR0.55000-100-50050100150-100-50050100150TEMPERATURE (°C)TEMPERATURE (°C) FIGURE 7. IBIAS vs TEMPERATURE, (VS = ±1.5V ) FIGURE 8. IOS vs TEMPERATURE (VS = ±18V) FN8411 Rev.4.00 Page 10 of 25 Jul 6, 2017 Document Outline Related Literature Features Applications Table of Contents Pin Configuration Pin Descriptions Ordering Information Absolute Maximum Ratings Thermal Information Recommended Operating Conditions Electrical Specifications VS = ±18V Electrical Specifications VS = ±2.5V Electrical Specifications VS = ±1.5V Electrical Specifications VS = ±18V - Post Radiation Electrical Specifications VS = ±2.5V - Post Radiation Electrical Specifications VS = ±1.5V - Post Radiation Typical Performance Curves Post High Dose Rate Radiation Characteristics Post Low Dose Rate Radiation Characteristics Applications Information Functional Description Operating Voltage Range Input Performance Input ESD Diode Protection Output Short-Circuit Current Limiting Output Phase Reversal Power Dissipation Unused Channel Configuration Die Characteristics Die Dimensions Interface Materials Glassivation Top Metallization Backside Finish Process Assembly Related Information Substrate Potential Additional Information Worst Case Current Density Transistor Count Weight of Packaged Device Lid Characteristics Metallization Mask Layout Revision History About Intersil Package Outline Drawing